Samtec, Inc.

High-Density Array Cable Assemblies suit constrained spaces.
Electrical Equipment & Systems

High-Density Array Cable Assemblies suit constrained spaces.

With performance to 15 Gbps and up to 300 total Edge Rate-® contacts, SEARAY™ .0315 in. pitch array cable assemblies (ESCA Series) are designed for high-speed, space-constrained applications. Products offer 50 Ω single-ended signal routing on 34 AWG micro ribbon coax cable with 20 or 30 contacts per row in 8 and 10 row designs. Features include signal to ground ratio of 4:1, optional screw...

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High-Density Array Cable Assemblies suit constrained spaces.
Electrical Equipment & Systems

High-Density Array Cable Assemblies suit constrained spaces.

With performance to 15 Gbps and up to 300 total Edge RateÂ-® contacts, SEARAY™ .0315 in. pitch array cable assemblies (ESCA Series) are designed for high-speed, space-constrained applications. Products offer 50 Ω single-ended signal routing on 34 AWG micro ribbon coax cable with 20 or 30 contacts per row in 8 and 10 row designs. Features include signal to ground ratio of 4:1, optional...

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Samtec, Inc. and Amphenol® Aerospace Partner to Address the Growing Need for Embedded Optics in Rugged Environments
Communication Systems & Equipment

Samtec, Inc. and Amphenol® Aerospace Partner to Address the Growing Need for Embedded Optics in Rugged Environments

Samtec, Inc. and Amphenol® Aerospace, a division of Amphenol Corporation (NYSE: APH), are excited to announce a strategic partnership addressing the growing need for embedded optics in rugged environments. Samtec is releasing an extended temperature embedded optical module utilizing the popular FireFly platform. This new FireFly will have architectures supporting 12 channels as well as 4...

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Samtec, Inc. and Amphenol-® Aerospace Partner to Address the Growing Need for Embedded Optics in Rugged Environments
Communication Systems & Equipment

Samtec, Inc. and Amphenol-® Aerospace Partner to Address the Growing Need for Embedded Optics in Rugged Environments

Samtec, Inc. and Amphenol-® Aerospace, a division of Amphenol Corporation (NYSE: APH), are excited to announce a strategic partnership addressing the growing need for embedded optics in rugged environments. Samtec is releasing an extended temperature embedded optical module utilizing the popular FireFly platform. This new FireFly will have architectures supporting 12 channels as well as 4...

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Press Fit Right Angle Socket Array affords design flexibility.
Construction Equipment and Supplies

Press Fit Right Angle Socket Array affords design flexibility.

SEARAY™ Open Pin Field Arrays of SEAFP-RA Series include- right angle socket with press fit terminations. Suited for micro backplane applications, high-density solution is available in 8- and 10- row designs with up to 500 total I/Os on a .050 in. pitch grid and features Edge Rate® contact system. Design maximizes grounding and routing flexibility while also promoting cycle life...

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Press Fit Right Angle Socket Array affords design flexibility.
Construction Equipment and Supplies

Press Fit Right Angle Socket Array affords design flexibility.

SEARAY™ Open Pin Field Arrays of SEAFP-RA Series includeÂ- right angle socket with press fit terminations. Suited for micro backplane applications, high-density solution is available in 8- and 10- row designs with up to 500 total I/Os on a .050 in. pitch grid and features Edge Rate® contact system. Design maximizes grounding and routing flexibility while also promoting cycle...

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High Speed Elevated Array offers design density and flexibility.
Construction Equipment and Supplies

High Speed Elevated Array offers design density and flexibility.

Supporting 28+ Gbps applications- and PCIe®/XAUI specifications, SkyRay™ consists of one riser and 2 receptacles (TPAR/TPAF Series) that, when mated, provide elevated 35 mm stack height. High-density wafers inside riser have helical crossover design to reduce crosstalk in 100 Ω differential applications, and choice of 1, 2 or 3 module configurations is available with 50...

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High Speed Elevated Array offers design density and flexibility.
Construction Equipment and Supplies

High Speed Elevated Array offers design density and flexibility.

Supporting 28+ Gbps applicationsÂ- and PCIe®/XAUI specifications, SkyRay™ consists of one riser and 2 receptacles (TPAR/TPAF Series) that, when mated, provide elevated 35 mm stack height. High-density wafers inside riser have helical crossover design to reduce crosstalk in 100 Ω differential applications, and choice of 1, 2 or 3 module configurations is...

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Low-Profile, High Density Interposers provide design flexibility.
Construction Equipment and Supplies

Low-Profile, High Density Interposers provide design flexibility.

Used as interposers or integrated into connector housings, Z-Ray™ 0.80 mm pitch, one-piece compression contact arrays offer 28+ Gbps performance. ZA8 Series, available with choice of dual compression contacts or single compression with solder balls, has up to 400 total BeCu micro-formed contacts and features 25 g normal force with .008 in. contact deflection. Available in customizable shapes...

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Low-Profile, High Density Interposers provide design flexibility.
Construction Equipment and Supplies

Low-Profile, High Density Interposers provide design flexibility.

Used as interposers or integrated into connector housings, Z-Ray™ 0.80 mm pitch, one-piece compression contact arrays offer 28+ Gbps performance. ZA8 Series, available with choice of dual compression contacts or single compression with solder balls, has up to 400 total BeCu micro-formed contacts and features 25 g normal force with .008 in. contact deflection. Available in customizable shapes...

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