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Advantest America, Inc.

Test & Measurement

Memory Tester supports up to 256 DDR3 devices.

Offering parallel test capability of up to 256 devices, T5503 8448 Channel Test Head is able to test DDR3-SDRAM, GDDR3, and GDDR4 devices and more at test speeds upt to 3.2 Gbps. It is compatible with M6242 Dynamic Test Handler, providing solution for high-volume back-end testing. Optional pin card enables use with stacked DRAM.

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Test & Measurement

Memory Test System offers 768 DUT parallel test capacity.

Along with 533 Mbps capability, T5385 delivers flexible pin configuration that supports diverse DRAM devices. Tester pin resources can be optimally allocated for efficiency, reduced touchdowns, and improved throughput. Solution also delivers Known Good Die (KGD) for consumer devices, promoting yields for low power DDR2 (LPDDR2) and DDR3 multi-die and stacked devices. Also, high-speed memory...

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Test & Measurement

DDR3 Test System has 256 DUT parallel test capacity.

Compatible with M6242 dynamic test handler for high-volume back-end test, T5503 8448 Channel Test Head offers max test speed of 3.2 Gbps for devices such as DDR3-SDRAM, GDDR3, and GDDR4. Optional configuration enables 256-DUT parallel test capacity for stacked DRAM; bare-die stacking technology increases pin count of DDR3-SDRAM devices. Optional pin card is available that preserves 256-DUT...

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Test & Measurement

Test System targets analog IC with up to 32 pins.

In module configuration, ADS1911 can perform parallel test of up to 8 discrete devices and analog ICs. DC calibration function ensures accurate DC test by allowing for minimal performance gaps between multiple installed systems. Also included, test program creation tool allows selection of test parameters from pull-down menus to facilitate and accelerate creation of test programs. Capabilities...

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Test & Measurement

Memory Test System offers speeds of 266 MHz/533 Mbps.

Able to simultaneously test up to 256 devices, Model T5782 is suited for testing flash memories as well as memory-embedded microcontrollers and memory bus environments. Tester incorporates flash functions including ECC and Block Management, which enable system to address diversified needs. At-speed, at-specification performance meets requirements of Known Good Die and Multi Chip Package memory...

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Test & Measurement

RF Test Cell System offers scalability to 128 RF ports.

Featuring OPENSTAR-®-compliant open architecture, T2000 SoC Test System consists of T2000 LS mainframe configured with 12 GHz RF monolithic module and integrated with M4841 Handler using parallel interface for quad-site parallel testing environment. Capable of testing 4 RF devices in parallel, air-cooled, quad-DUT module features 32 RF pins, each with access to VSG and VSA supporting 40 MHz of...

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Test & Measurement

Mixed-Signal Test System targets automotive device market.

Intended for mixed-signal, multi-pin devices, Model T7723 offers scalable architecture, parallel testing of up to 32 devices, and 30 A high-voltage test capability. Up to 64 relay circuits can be integrated within test unit, enabling system to efficiently direct and measure electrical current. Model T7723 can perform simultaneous test of high-density, high-voltage devices that incorporate BCD...

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Test & Measurement

Memory Test System addresses high-volume DDR3-SDRAM devices.

With maximum test speeds of 3.2 Gbps and data transmission speeds of over 1 Gbps, T5503 is deigned for package testing of up to 128 DDR3-SDRAM devices simultaneously. It has semiconductor circuitry that utilizes CMOS technology and is also suited for testing GDDR3 and GDDR4 devices. Support is also provided for source-synchronous test with use of multi-strobe technology, which measures phase...

Read More »
Test & Measurement

Memory Tester supports up to 256 DDR3 devices.

Offering parallel test capability of up to 256 devices, T5503 8448 Channel Test Head is able to test DDR3-SDRAM, GDDR3, and GDDR4 devices and more at test speeds upt to 3.2 Gbps. It is compatible with M6242 Dynamic Test Handler, providing solution for high-volume back-end testing. Optional pin card enables use with stacked DRAM.

Read More »
Test & Measurement

Memory Test System offers 768 DUT parallel test capacity.

Along with 533 Mbps capability, T5385 delivers flexible pin configuration that supports diverse DRAM devices. Tester pin resources can be optimally allocated for efficiency, reduced touchdowns, and improved throughput. Solution also delivers Known Good Die (KGD) for consumer devices, promoting yields for low power DDR2 (LPDDR2) and DDR3 multi-die and stacked devices. Also, high-speed memory...

Read More »
Test & Measurement

DDR3 Test System has 256 DUT parallel test capacity.

Compatible with M6242 dynamic test handler for high-volume back-end test, T5503 8448 Channel Test Head offers max test speed of 3.2 Gbps for devices such as DDR3-SDRAM, GDDR3, and GDDR4. Optional configuration enables 256-DUT parallel test capacity for stacked DRAM; bare-die stacking technology increases pin count of DDR3-SDRAM devices. Optional pin card is available that preserves 256-DUT...

Read More »
Test & Measurement

Test System targets analog IC with up to 32 pins.

In module configuration, ADS1911 can perform parallel test of up to 8 discrete devices and analog ICs. DC calibration function ensures accurate DC test by allowing for minimal performance gaps between multiple installed systems. Also included, test program creation tool allows selection of test parameters from pull-down menus to facilitate and accelerate creation of test programs. Capabilities...

Read More »
Test & Measurement

Memory Test System offers speeds of 266 MHz/533 Mbps.

Able to simultaneously test up to 256 devices, Model T5782 is suited for testing flash memories as well as memory-embedded microcontrollers and memory bus environments. Tester incorporates flash functions including ECC and Block Management, which enable system to address diversified needs. At-speed, at-specification performance meets requirements of Known Good Die and Multi Chip Package memory...

Read More »
Test & Measurement

RF Test Cell System offers scalability to 128 RF ports.

Featuring OPENSTAR-®-compliant open architecture, T2000 SoC Test System consists of T2000 LS mainframe configured with 12 GHz RF monolithic module and integrated with M4841 Handler using parallel interface for quad-site parallel testing environment. Capable of testing 4 RF devices in parallel, air-cooled, quad-DUT module features 32 RF pins, each with access to VSG and VSA supporting 40 MHz of...

Read More »
Test & Measurement

Mixed-Signal Test System targets automotive device market.

Intended for mixed-signal, multi-pin devices, Model T7723 offers scalable architecture, parallel testing of up to 32 devices, and 30 A high-voltage test capability. Up to 64 relay circuits can be integrated within test unit, enabling system to efficiently direct and measure electrical current. Model T7723 can perform simultaneous test of high-density, high-voltage devices that incorporate BCD...

Read More »
Test & Measurement

Memory Test System addresses high-volume DDR3-SDRAM devices.

With maximum test speeds of 3.2 Gbps and data transmission speeds of over 1 Gbps, T5503 is deigned for package testing of up to 128 DDR3-SDRAM devices simultaneously. It has semiconductor circuitry that utilizes CMOS technology and is also suited for testing GDDR3 and GDDR4 devices. Support is also provided for source-synchronous test with use of multi-strobe technology, which measures phase...

Read More »

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