Advantest America, Inc.
Baldwin Park, CA 91706
Share:
Advantest's Integrated SoC Tester/Handler Test Cell Wins 2008 Best in Test Award
SANTA CLARA, Calif., Jan. 22 - Advantest Corporation announces that its integrated T2000 LS Mainframe and M4841 Dynamic Test Handler - the company's high-performance SoC Test Cell - has won a 2008 Best in Test Award. Introduced at Semicon West 2007, Advantest's T2000 LSMF/M4841 Test Cell was selected by the editors of Test & Measurement World magazine, as a Best in Test product for its innovation...
Read More »Advantest and Wavecrest Co-Develop Jitter Analysis Tool for Test of Complex Internet IC Technology
... both members of Semiconductor Test Consortium, companies partner to broaden applications for open architecture test SANTA CLARA, Calif. and EDEN PRAIRIE, Minn., July 13 / - Advantest Corporation , the world's leading supplier of semiconductor test equipment, and Wavecrest Corporation, a leader in designing and manufacturing cutting-edge test and measurement solutions for analysis of signal...
Read More »LCD Driver IC offers parallel test for up to 32 devices.
With 512 channels for digital test of image signal inputs and 3072 channels for outputs, Model T6373 is suited for LCD source, gate, and one-chip controller driver ICs. It comes with high-accuracy digitizer unit for each of its LCD channels, enabling testing of higher bit resolution and pin count ICs. Featuring test speed of 125 MHz and data rate of 250/500/875 Mbps, unit also offers testing for...
Read More »Dynamic Test Handler offers 20,000 units/hr throughput.
Designed for memory devices such as DDR2/3-SDRAM in packages such as BGA, CSP, TSOP1, and TSOP2, modular M6241 provides efficient device transfer for parallel test of up to 512 units through integrated handling and insert mechanisms. Heating mechanism controls temperature fluctuations between DUTs, resulting in temperature stability to 17%. In addition to pitch conversion kit mechanism, option is...
Read More »Dynamic Test Handler offers volume testing of MCUs and DSPs.
Supporting BGA, CSP, and QFP packages, Model M4841 provides maximum parallel test capacity of 16 devices and throughput of 18,500 devices/hr. It employs advanced temperature-stabilization to cool devices to -40Ã-
Read More »SoC Test System offers 3 module options.
With T6577 SoC Test System, users can conduct tests on complex, multi-functional SoC devices. DDR2 Interface Test Option supports source synchronization techniques and enables at-speed test of memory interface functions and ac test. Featuring 16 channels, BBWGD Option adds baseband and analog test capability within 100 MHz range of signals. With 4 channels per module, SG/JMM module tests...
Read More »Memory Test System has parallel test capacity of 384 devices.
Model T5383 is designed for multipurpose memory devices like DRAM, SDRAM, and DDR SDRAM, as well as flash memory and package test of MCP and other devices. With maximum test speed of 286 MHz/572 Mbps in DDR mode, system also offers high speeds and high throughput on KGD and at-speed tests for DRAM wafers. Wafer motherboard incorporates docking mechanism which helps prevent probe card warpage.
Read More »Memory Test System suits wafer/package level NAND testing.
With parallel test capacity of up to 512 devices, Model T5761 features ECC, real-time counter to calculate number of fail bits, and flash memory block management that allows skipping unneeded blocks without testing. Model T5761ES offers up to 16 devices test capacity and simplifies low-volume device evaluation and facilitates development of test programs for high-volume production. Models...
Read More »Mixed-Signal Module enables testing of multi-channel SoCs.
Featuring 16 channels and DSP-based architecture, Base Band Waveform Generator Digitizer Module satisfies diverse mixed-signal testing needs, including DC, audio, video, base band, and high frequencies on single board. Module offers 300 MHz undersampling BW and 16-bit performance. DUT independent triggering allows capturing fewer samples in asynchronous designs, while channel independent clocking...
Read More »IC Socket tests high-speed devices.
Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125Ã-
Read More »Advantest's Integrated SoC Tester/Handler Test Cell Wins 2008 Best in Test Award
SANTA CLARA, Calif., Jan. 22 - Advantest Corporation announces that its integrated T2000 LS Mainframe and M4841 Dynamic Test Handler - the company's high-performance SoC Test Cell - has won a 2008 Best in Test Award. Introduced at Semicon West 2007, Advantest's T2000 LSMF/M4841 Test Cell was selected by the editors of Test & Measurement World magazine, as a Best in Test product for its innovation...
Read More »Advantest and Wavecrest Co-Develop Jitter Analysis Tool for Test of Complex Internet IC Technology
... both members of Semiconductor Test Consortium, companies partner to broaden applications for open architecture test SANTA CLARA, Calif. and EDEN PRAIRIE, Minn., July 13 / - Advantest Corporation , the world's leading supplier of semiconductor test equipment, and Wavecrest Corporation, a leader in designing and manufacturing cutting-edge test and measurement solutions for analysis of signal...
Read More »LCD Driver IC offers parallel test for up to 32 devices.
With 512 channels for digital test of image signal inputs and 3072 channels for outputs, Model T6373 is suited for LCD source, gate, and one-chip controller driver ICs. It comes with high-accuracy digitizer unit for each of its LCD channels, enabling testing of higher bit resolution and pin count ICs. Featuring test speed of 125 MHz and data rate of 250/500/875 Mbps, unit also offers testing for...
Read More »Dynamic Test Handler offers 20,000 units/hr throughput.
Designed for memory devices such as DDR2/3-SDRAM in packages such as BGA, CSP, TSOP1, and TSOP2, modular M6241 provides efficient device transfer for parallel test of up to 512 units through integrated handling and insert mechanisms. Heating mechanism controls temperature fluctuations between DUTs, resulting in temperature stability to 17%. In addition to pitch conversion kit mechanism, option is...
Read More »Dynamic Test Handler offers volume testing of MCUs and DSPs.
Supporting BGA, CSP, and QFP packages, Model M4841 provides maximum parallel test capacity of 16 devices and throughput of 18,500 devices/hr. It employs advanced temperature-stabilization to cool devices to -40Ã-
Read More »SoC Test System offers 3 module options.
With T6577 SoC Test System, users can conduct tests on complex, multi-functional SoC devices. DDR2 Interface Test Option supports source synchronization techniques and enables at-speed test of memory interface functions and ac test. Featuring 16 channels, BBWGD Option adds baseband and analog test capability within 100 MHz range of signals. With 4 channels per module, SG/JMM module tests...
Read More »Memory Test System has parallel test capacity of 384 devices.
Model T5383 is designed for multipurpose memory devices like DRAM, SDRAM, and DDR SDRAM, as well as flash memory and package test of MCP and other devices. With maximum test speed of 286 MHz/572 Mbps in DDR mode, system also offers high speeds and high throughput on KGD and at-speed tests for DRAM wafers. Wafer motherboard incorporates docking mechanism which helps prevent probe card warpage.
Read More »Memory Test System suits wafer/package level NAND testing.
With parallel test capacity of up to 512 devices, Model T5761 features ECC, real-time counter to calculate number of fail bits, and flash memory block management that allows skipping unneeded blocks without testing. Model T5761ES offers up to 16 devices test capacity and simplifies low-volume device evaluation and facilitates development of test programs for high-volume production. Models...
Read More »Mixed-Signal Module enables testing of multi-channel SoCs.
Featuring 16 channels and DSP-based architecture, Base Band Waveform Generator Digitizer Module satisfies diverse mixed-signal testing needs, including DC, audio, video, base band, and high frequencies on single board. Module offers 300 MHz undersampling BW and 16-bit performance. DUT independent triggering allows capturing fewer samples in asynchronous designs, while channel independent clocking...
Read More »IC Socket tests high-speed devices.
Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125Ã-
Read More »