Press Release Summary:
Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125Â°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8, 1, and 1.27 mm pitches.
Original Press Release:
Advantest Launches Low-Inductance IC Socket
High-Speed Device Package Test, Outstanding Reliability and Accuracy
TOKYO, Dec. 9 - Advantest Corporation , the world's largest provider of test equipment to the global semiconductor industry, today announced the availability of test interfacing featuring the company's newly developed low-inductance (<0.4nH) IC socket. While meeting the rigors of high volume production, the new socket is ideal for package test of high-speed devices such as DDR3-SDRAM and SoC, and delivers significant yield improvements through its outstandingly accurate, at-speed transmission of signals and low noise environment. The company will exhibit the new device interface during SEMICON Japan 2005, December 7-9, at Chiba's Makuhari Messe.
As streaming media and other services accelerate broadband market penetration, the memory and SoC devices that drive computers and telecommunications products are making strides in speed and capacity. In at- speed package tests of these high-speed devices, the IC socket that provides the physical interface between the DUT and the test equipment must be of superlative quality. However, standard IC sockets are unequal to the challenge of accurately transmitting high-speed signals to and from devices with operating frequencies of 1GHz or greater. As a result, manufacturers see losses in test accuracy and yield.
Advantest's newly developed low-inductance IC socket employs cutting-edge micro-machining technology in a proprietary contact architecture, reducing self-inductance -- which causes signal degradation -- to a mere <0.4 nH, a 73% reduction from the self-inductance value of the company's previous model. The socket is mounted in a test fixture that delivers low transmission loss and suppresses reflection noise and power supply fluctuations. With this device interface, even high-speed devices with operating frequencies of over 1 GHz can be tested at-speed with great accuracy, often bringing dramatic yield gains.
This product launch underlines Advantest's ability to provide total test solutions for front-end and back-end requirements. Always on the cutting edge of device technology, the company's testers, handlers, and device interfaces empower manufacturers to create a flexible and cost-effective test environment.
Applicable Packages: BGA, FBGA, CSP
Supported Pitches: Ball-pitch .75 mm, 0.8 mm, 1 mm, 1.27 mm
Frequency Band: >8 GHz (@ -1 dB)
>12 GHz (@ -2 dB)
Self-Inductance: <0.4 nH
Inter-pin Capacitance: <0.2 pF
Operating Temperature Range: -30 degrees Celsius ~ 125 degrees Celsius
Please Direct Further Enquiries About This Product To DI Solutions Business Division tel: 0276-70-3384
Advantest Corporation is the world's leading automatic test equipment supplier to the semiconductor industry, and also produces electronic and optoelectronic instruments and systems. A global company, Advantest has long offered total ATE solutions, and serves the industry in every component of semiconductor test: tester, handler, mechanical and electrical interfaces, and software. Its logic, memory, mixed-signal and RF testers and device handlers are integrated into the most advanced semiconductor production lines in the world. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has 43 subsidiaries worldwide. Among them, Advantest America, Inc. is based in Santa Clara, CA., and Advantest (Europe) GmBH is based in Munich, Germany. More information is available at http://www.advantest.co.jp/
CONTACT: Amy Gold, Advantest America, Inc., A.Gold@Advantest.com