Aprima Medical Software, Inc

Miniature Switches suit handheld equipment.
Electrical Equipment & Systems

Miniature Switches suit handheld equipment.

Washable Series G toggle and rocker switches measure .276 x .276 x .177 in., allowing for high-density mounting. Sliding Twin Crossbar contact mechanism ensures that gold-plated contacts are wiped clean with every actuation. Single- and double-pole variations are available with 5 circuit combinations. Molded-in, epoxy-sealed terminals lock out flux, solvents, and contaminants. Switches are rated...

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Pressure Transducers offer ranges from 5-1,000 psi.
Sensors, Monitors & Transducers

Pressure Transducers offer ranges from 5-1,000 psi.

Series DPS 4000 features digital CANbus serial communications interface. Fully temperature corrected pressure readings are output as digital word at up to 100 Hz in any one of 24 engineering units, requiring no user system set-up or calibration. Integral digital electronics provide 0.2% reading for values above 50% FS and 0.1% FS for readings below 50% FS. Transducers are fully input/output...

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Dock Lifts suit places where pit mounting is not an option.
Material Handling & Storage

Dock Lifts suit places where pit mounting is not an option.

Designed for use with powered pallet jacks and straddle stackers, 6200 models have 6 in. lowered height, 8,000 lb capacity, and 6 x 10 ft platform. Offered for all types of mobile material handling equipment, 6300 models have 8 in. lowered height, 12,000 lb capacity, and 6 x 12 ft platform. Both surface mount dock lift types have 60 in. raised height, and are equipped with approach ramps, 18 x 66...

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Opacity Monitor automatically corrects for dirt accumulation.
Communication Systems & Equipment

Opacity Monitor automatically corrects for dirt accumulation.

Model KVB measures opacity or dust concentration in stack gases. Vibration-resistant unit uses laser light source, which provides wavelength stability and 100% beam collimation. Opacity monitor, with weatherproof housing weighs, less than 40 lbs and has 1 mm beam dia. It includes on-line zero calibration feature, and does not require factory calibration. MIP opacity monitor has data acquisition...

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Interface Module and Software synchronizes with DAQ.
Controls & Controllers

Interface Module and Software synchronizes with DAQ.

Model FP-1300 FieldPoint CAN interface module provides access to 50+ I/O modules by adding distributed I/O to capabilities of CAN-based measurement systems and direct CAN connectivity to sensors/actuators. Users can add CAN nodes containing up to 9 I/O modules each to existing CAN networks. NI-CAN v2.0 driver software allows engineers to specify arbitration ID and customize I/O data configuration...

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PXI Chassis offers precision timing and synchronization.
Computer Hardware & Peripherals

PXI Chassis offers precision timing and synchronization.

Model PXI-1042, 8-slot PXI chassis incorporates low-jitter internal reference clock and external clock connectors. Suited for real-time, automated test, and data acquisition (DAQ) applications, product provides platform for bench-top or rack-mounted test and control systems. It combines 8-slot backplane with power supply, integrated cooling, and compact structural design. Chassis also features...

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Software

LabVIEW Software works with Mac OS X v10.2 Jaguar.

With no fixed memory limits, LabVIEW graphical development environment creates real-time embedded measurement applications. It incorporates true protected memory, preemptive multitasking, and advanced memory management, allowing users to create applications or virtual instruments for acquiring, analyzing, and presenting technical data. Diagrams can execute in parallel manner using OS to break...

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Electrical Equipment & Systems

RF Test Sockets feature conduction-cooled system.

Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194Â-

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