Solder

Flux

Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif. LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput yields,...

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PV Metallization Pastes optimize solar panel performance.
Solar Energy Equipment

PV Metallization Pastes optimize solar panel performance.

Intended for crystalline silicon solar cells, DuPont™ Solamet® PV18H and PV18J utilize proprietary Tellurium technology, which optimizes conversion efficiency of solar cellsÂ- and allows extremely fine line printability down to 35 microns. Solamet® PV18H enables optimized contact resistance to enhanced lightly doped emitters on mono-crystalline solar cells, while Solamet®...

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Stencils

See FCT Assembly's Technical Experts in Pennsylvania Next Week

GREELEY, CO — FCT Assembly today announced plans to exhibit at the SMTA Philadelphia and SMTA West Penn Expos. The SMTA Philadelphia Expo Tech Forum is scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia Cherry Hill in Cherry Hill, NJ, and the SMTA West Penn Expo & Tech Forum is scheduled to take place Thursday August 14, 2014 at the Doubletree Hotel in...

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Solder

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi

Indium Corporation will feature its new solder paste, Indium10.1, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide...

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Solder Ball Placement Kit reworks small components.
Soldering Machinery

Solder Ball Placement Kit reworks small components.

When added to hot air pencil, Solder Ball Placement Kit provides complete solution for reworking most small chip components, such as 01005, 0201, 0402, and 0602s. Kit contains: 2,000 each of .04, .06, .08, and .10 mm solder balls with container; 4 ESD-safe carbon fiber reinforced oilers; one part positioning matrix and squeegee; one PEEK spudger; one bent tweezers; one half tweezers; and one...

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Solder

Pb-Free Solder Paste suits high complexity PCBs.

Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F,...

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Solder Paste Retainer features spring loaded design.
Retainers

Solder Paste Retainer features spring loaded design.

Designed to optimize management of solder paste within printing area, Model SPR helps eliminate leakage of solder paste by way of floating spring supported paste retainer attached to end of squeegee holder. Unit applies constant pressure downward and glides along stencil surface, setting up optimized dam and seal.

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Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging
Solder

Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging

Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany. SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength...

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Paste

Nihon Superior Thanks SN100C Licensees and Partners

OSAKA, JAPANÂ- Ã‚ – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, is pleased to announce its success from the recent IPC APEX EXPO in Las Vegas, Nevada. Nihon Superior's latest joining material; Alconano Nano-Silver Paste was displayed with the actual power module product using nano-silver paste manufactured by Shindengen Electric...

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Indium Corporation Features SACm(TM) at NEPCON China
Solder

Indium Corporation Features SACm(TM) at NEPCON China

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China. SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling – all at a cost below that of typical SAC solder paste. SACm™ meets the electronics assembly market’s demand for a solder paste that...

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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
Sponsored

Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life

For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.

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