Solder

Solder

Lockheed Martin Advanced Technology Center Develops Revolutionary Nanotechnology Copper Solder

PALO ALTO, Calif. -- Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 °C. Once fully optimized, the CuantumFuse(TM) solder material is expected to produce...

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Nihon Superior Scores Its 20th Industry Award with the SN100C P810 D4 Solder Paste
Solder

Nihon Superior Scores Its 20th Industry Award with the SN100C P810 D4 Solder Paste

OSAKA, JAPAN - Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2012 Global Technology Award in the category of Materials - Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste. The award was presented to the company during a Tuesday, October 16, 2012 ceremony that took place at the Walt Disney...

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Solder

Solder Alloy is available in Pb-free bar form.

Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickelÂ- and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does...

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Solder Paste exhibits low voiding properties.
Solder

Solder Paste exhibits low voiding properties.

Designed for use in vacuum reflow with nitrogen,Â- SN100C P810 D4 no-clean, lead-free solder paste reduces voiding to less than 1% in measured void area. Properties include melting point of 227°C, flux content of 11.5% mass, and spread factor of 75%. Generally, product can be reflowed with profile similar to that commonly used with SAC305 and SAC405 with 245°C peak....

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Stencils

FCT Assembly to Highlight Root Cause Analysis Capabilities at SMTA International 2012

MILPITAS, Calif. - FCT Assembly announces that it will exhibit in booth #508 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the Walt Disney World Dolphin Hotel in Orlando, FL. FCT Assembly manufactures several core products including leaded and lead-free solder paste, wire solder, bar solder,...

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AIM to Highlight New NC259 Solder Paste at SMTA International 2012
Flux

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the...

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Applicators

Balver Zinn/Cobar's SN100C Solder Wire Used in the IPC Midwest Hand Solder Competition

The Balver Zinn Group announces that Cobar Solder Products Inc.'s SN100C Wire Solder and Cobrush flux applicator were featured during the annual Hand Solder Competition at the recently held IPC Midwest exhibition in Schaumburg, IL. Lance Larrabee, General Manager of Cobar Solder Products Inc., said, Balver Zinn/Cobar is pleased to support the IPC Midwest Hand Solder Competition with solder that...

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Solder

Cobar Solder Products Now Carries Balver Zinn SN100C Water Soluble Solder Wire

The Balver Zinn Group announces that Cobar Solder Products Inc. now carries Balver Zinn LF3237 Solder Wire, a heat activated water soluble flux formulation for special applications. Balver Zinn LF3237 shows fast and excellent wetting properties. Because of the high halide content of 1.2 percent, LF3237 performs very well on all available PCB finishes. With the LF3237 Solder Wire, residues are...

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Cobar Solder Products to Sponsor the Second Annual IPC Midwest Soldering Competition
Flux

Cobar Solder Products to Sponsor the Second Annual IPC Midwest Soldering Competition

The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and...

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AIM to Showcase NC259 Solder Paste at IPC Midwest
Flux

AIM to Showcase NC259 Solder Paste at IPC Midwest

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. This...

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