Solder

No-Clean Solder Paste suits PoP applications.
Solder

No-Clean Solder Paste suits PoP applications.

Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping.

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Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste
Solder

Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste

OSAKA, JAPANÂ- – Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San...

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Reflow Soldering System offers void-free results. .
Electrical Connectors

Reflow Soldering System offers void-free results. .

Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...

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Circuit Board Assembly Services

SchmartBoard Releases New Board for TIMSP430F5172 Low Cost Development Board is Fully Populated for just $35.00

San Ramon, CA- SchmartBoard, a company that makes prototyping electronic circuits easier, has expanded its product offering with a new development board to support users of Texas Instruments microcontrollers. These boards use our EZ" soldering technology to assure fast, easy and flawless soldering. According to Texas Instruments online product information:(http://www.ti.com/product/msp430f5172)...

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FCT Assembly to Debut New NanoSlic(TM) Multilayer Coating at the IPC APEX EXPO
Coatings

FCT Assembly to Debut New NanoSlic(TM) Multilayer Coating at the IPC APEX EXPO

GREELEY, CO - FCT Assembly announces that it will highlight its new NanoSlic(TM) Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. Florida CirTech has developed the world's first user upgradeable Nano Coating technology for solder paste stencils. It is comprised of 1) A...

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Visit Booth #1527 at the IPC APEX EXPO - PARMI to Showcase HS-70 Solder Paste Inspection System
Inspection Equipment

Visit Booth #1527 at the IPC APEX EXPO - PARMI to Showcase HS-70 Solder Paste Inspection System

MARLBORO, MA - With more than 1,500 installations PARMI, a world leader in three-dimensional inspection of printed solder paste on PCBs, announces it will exhibit in booth #1527 at the IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. PARMI's SPI HS70 Series is a next-generation in-line solder paste inspection (SPI) system. The system...

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AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO
Flux

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving...

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Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO
Flux

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

OSAKA, JAPAN- Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce a range of newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields. These products will be displayed in Booth #833 at the upcoming IPC...

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Visit OK International at MD&M/Electronics West to Preview Metcal's New MX-5200
Soldering Machinery

Visit OK International at MD&M/Electronics West to Preview Metcal's New MX-5200

GARDEN GROVE, CA- OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 413 at the upcoming Medical Design & Manufacturing (MD&M)/Electronics West Exposition, scheduled to take place February 12-14, 2013 at the Anaheim Convention Center in Anaheim, California. The system offers the same increased productivity and process control as the...

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New Line Offers Fast, Accurate Assembly of High-Mix SMT PCBS with Utlra-Fast Job Changes
Assembly Machinery

New Line Offers Fast, Accurate Assembly of High-Mix SMT PCBS with Utlra-Fast Job Changes

Electronics assemblers with high mix jobs, a need for automated assembly of 10,000 components per hour (cph), and stringent accuracy requirements will find what they're looking for in Manncorp's new 'High Mix High Flexibility' SMT assembly line. Turnkey assembly lines offer several advantages over putting a production line together machine by machine, including the peace of mind of a single...

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