Solder

Material Handling Equipment

Indium Corporation Soldering Products Meet New IPC J-STD004B

Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability. Users'...

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Miscellaneous Film

Heraeus Photovoltaics Business Unit to Attend EU PVSEC 2013 in Paris

Â- Heraeus to showcase new metallization pastes for higher efficiency solar cells at a lower cost per Wp HANAU, Germany – The Heraeus Photovoltaics Business Unit will be attending the exhibition of EU PVSEC 2013 in Paris, Parc des Expositions Paris Nord Villepinte, hall 2, booth 2/C3, from October 1-3, 2013. Heraeus will be highlighting several of their newest products in their...

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Stencils

Printing Intelligence Capability Raises the Bar

See the Latest DEK Advances at SMTA International At next month's SMTA International event in Fort Worth, Texas, DEK will show visitors how its intelligent printing technology can help raise yields, increase throughput and lower costs.Â-  With brand new products that enable parallel processing capability and minimal requirements for operator intervention, DEK is moving the industry...

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Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International
Flux

Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Representatives from Cobar will display the company’s latest solder wire and paste technologies, including BRILLIANT B2012 Solder Wire and OT2 Solder Paste. Balver...

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Meet the Juki Team at SMTA International
Printing Screens

Meet the Juki Team at SMTA International

MORRISVILLE, NCÂ- – Juki Automation Systems, Inc., a world-leading provider of automated assembly products and part of Juki Corporation, will exhibit in Booth #233 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. As a complete solutions provider, company representatives will highlight Juki’s placement...

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Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI
Flux

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges...

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Inspection Equipment

Absolute EMS Adds CyberOptics SPI and AOI Inspection Systems to Its Expanding Lines

CyberOptics Corporation (Nasdaq: CYBE) a world leader in AOI and SPI inspection solutions for the global electronics assembly and semiconductor capital equipment markets, announces that Absolute EMS has purchased both its SPI and AOI inspection systems as part of its recent expansion. CyberOptics’ SE500 SPI system will provide Absolute EMS the advantage of accurately measuring solder paste and...

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Solder

Halogen-Free Solder Paste offers consistent print performance.

Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion...

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Solder Alloy maximizes drop shock performance of electronics.
Solder

Solder Alloy maximizes drop shock performance of electronics.

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect.Â- SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without...

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Nihon Superior to Address Soldering Challenges at NEPCON South China
Flux

Nihon Superior to Address Soldering Challenges at NEPCON South China

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the...

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