Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
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New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
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New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
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AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
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Choosing the Right Material for Your Project
When choosing an appropriate metal material, the range of options is so broad that selecting the correct material for your unique application can be challenging. Different metals have characteristics that can affect weldability, ductility, and formability. Our new eBook outlines the unique properties and applications of popular metals including: Stainless Steel Brass Aluminum Copper Titanium
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New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
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New InFORMS Solder Preforms and Ribbon Use a Reinforced Matrix
InFORMS consists of solder with a reinforcing matrix which provides mechanical and thermal reliability, uniform solder bondline thickness, and low-void performance. Also, InFORMS's strong and dependable joints allow for high power densities.
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Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...
Read More »High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste
(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...
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PF606-P245 Lead-free Solder Paste offers continuous high-speed printability.
PF606-P245 Lead-free Solder Paste is suitable for PCB designs. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.
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PF606-P140 Lead-free Solder Paste is suitable for PCB designs.
PF606-P140 Lead-free Solder Paste offers continuous high-speed printability. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.
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Clear Clogged Drains Faster with General Pipe Cleaners' Kinetic Water Ram
The Kinetic Water Ram by General Pipe Cleaners clears out clogged pipes quickly using kinetic energy. The Ram is so simple to operate, anyone can use it. Check out the video to learn more.
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