Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
Read More »
New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
Read More »
New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
Read More »
AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
Read More »
Polymer Protection For Optical Fiber
To learn more about the challenges your optical fibers face, and which polymers are best to protect them, download this white paper.
Read More »
New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
Read More »
New InFORMS Solder Preforms and Ribbon Use a Reinforced Matrix
InFORMS consists of solder with a reinforcing matrix which provides mechanical and thermal reliability, uniform solder bondline thickness, and low-void performance. Also, InFORMS's strong and dependable joints allow for high power densities.
Read More »
Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...
Read More »High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste
(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...
Read More »
PF606-P245 Lead-free Solder Paste offers continuous high-speed printability.
PF606-P245 Lead-free Solder Paste is suitable for PCB designs. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.
Read More »
PF606-P140 Lead-free Solder Paste is suitable for PCB designs.
PF606-P140 Lead-free Solder Paste offers continuous high-speed printability. Unit comes with reflow process window for solderability. Product helps to improve ICT testability and prevents contamination of test pins during test operation.
Read More »
What Can Test Devices Spin for You?
Test Devices helps you ensure the safety and efficiency of your high performance machines with cutting edge spin testing, rotor engineering, and precision balancing capabilities. Check out the video to learn more.
Read More »
