Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
Read More »
Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
Read More »
New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
Read More »
New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
Read More »Choosing the Right Load Ring for Your Needs
A Temper® Load Ring, also known as a Constant Force Adjustable Spacer, is a precision ring designed to perform as a predictable constant force element. It is fabricated from ductile, high strength stainless alloys.
Read More »
New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
Read More »
New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
Read More »
AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
Read More »
AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
Read More »
New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
Read More »
New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
Read More »
Triad's Next-Gen Power Supplies Offer Increased Reliability and Reduced Noise Performance
Triad Magnetics, an established leader in power supply design and manufacturing, is proud to announce their next generation WAU AC and WDU DC Series of power supplies. These linear wall plug-ins offer minimum noise performance without sacrificing reliability or life. See our video to learn more.
Read More »
