Silicone

Silicone

Two-Part Silicone Compound suits electronic applications.

Able to maintain electrical conductivity from -178 to +445°F, R-2634 electrically conductive, room-temperature vulcanized (RTV) paste achieves full cure at 77°F in 7 days. With heat-accelerated cure time of 30 min, R-2940 thermally conductive, RTV paste performs over -85 to +465°F temperature range. Operating over -178 to +465°F temperature range, CFI-6755 optically clear,...

Read More »
Conductive Silicones provide EMI/RFI shielding.
Silicone

Conductive Silicones provide EMI/RFI shielding.

BISCO® EC-2000 Series Conductive Silicones are nickel-graphite filled materials offering compression-set, flame and corrosion resistance. They come in wide continuous roll goods in thicknesses from 0.020 to 0.125 in., making them suitable for replacing fabric-over-foam in intricately shaped applications. EC-2000 products fall in 30-40 Shore A durometer range and are suitable for base...

Read More »
Silicone Material eliminates static buildup.
Silicone

Silicone Material eliminates static buildup.

Semi-conductive Silicone C material is suitable for use on drive and label rollers, and can also be used in direct thermal printing applications. Resistivity is rated down to E9-E12 ohm-cm, and durometers range from 30 to 60 Shore A. Material can withstand 300 to 400° F temperatures, which develop at printhead.

Read More »
Silicone Paste resists oil and liquid coolants.
Silicone

Silicone Paste resists oil and liquid coolants.

Loctite® 5970 fluid resistant formulation is suitable for flange sealing applications with excessive joint movement. Non-slumping and non-corrosive, Loctite® 5970 black, single-component, alkoxy RTV silicone paste is low odor, low volatility material, which does not contain MEKO (methylethylketoxime).

Read More »
Silicone

Silicone Compound comes in syringe applicator.

Non-flammable, non-corrosive Silicone Compound is made of zinc filled polysiloxane. It enables low-loss thermal pathway for heat transfer between semiconductors and heat sinks by displacing air gaps between mating surfaces. Compound forms non-curing seal and maintains flexibile consistency within temperature range of -40 F to 500 deg F. It provides dielectric strength of 250-350 volts/mil and...

Read More »

All Topics