New UVC Emitting Diodes from Vishay are Compatible with Reflow Soldering Processes
Device measures 3.5 mm by 3.5 mm by 1.2 mm. Offers an emission angle of ± 60° and high radiant power to 3.2 mW at 20 mA or 7.5 mW at 50 mA. Features maximum forward voltage of 6.5 V, wavelength range of 265 nm to 285 nm, and forward current up to 70 mA.
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New High-Voltage NMOS/PMOS Devices are Based on XT018 BCD-on-SOI Platform with Deep Trench Isolation
Provides more flexible voltage offering up to 200V to support the battery cells. Operating voltages from 70V to 125V. Support automotive AEC-Q100 Grade 0 products.
Read More »ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers
ANSYS power, noise and reliability solutions assist power-efficient IP design for ARM PITTSBURGH - ANSYS (NASDAQ: ANSS) has licensed its engineering simulation software tools to ARM (LON: ARM; Nasdaq: ARMH), the world's leading semiconductor intellectual property (IP) company for power efficiency, performance and reliability. The agreement will aid the ARM ecosystem and ARMÃ-® processor...
Read More »Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014
Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs SAN JOSE, Calif.Ã- – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.Ã- Altera experts in...
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6 Reasons to Consider Hydroforming over Traditional Metal Stamping
To learn more about the functions of the hydroforming process, the key differences from other processes, and why it is preferable over other stamping options, download this eBook now.
Read More »STMicroelectronics and Soundchip Introduce Components to Create Smart High-Definition Audio Accessories that Dazzle
Powerful new audio engines combined with high-performance MEMS microphones enable feature-rich, software-controlled headsets that take personal audio to the next level Geneva, Switzerland – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance audio ICs, together with Soundchip,...
Read More »VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC
SHANGHAI, -- VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class, custom silicon solutions and semiconductor IP provider, announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles. Both products are...
Read More »MagnaChip to Offer Cost Competitive Copper Wire Bonding
SEOUL, South Korea - MagnaChip Semiconductor Corporation ( MagnaChip Semiconductor ) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers cost competitive and state of the art copper wire bonding technology for the specialized needs of foundry customers. Copper bonding employs copper wires instead of gold for...
Read More »ECG/EEG Analog Front Ends offer on-chip respiration measurement.
By integrating 44 discrete components, 24-bit ADS1298R Series facilitates implementation of respiration detection in portable ECG equipment. Devices provide respiration impedance at resolution of 20 mW, enabling accurate monitoring and correlation of patient respiration to ECG abnormalities. Housed in 8 x 8 mm BGA package with 4, 6, or 8 channels, AFEs use only 750 Ã-µW/channel with multiple...
Read More »Broadcom Completes World's First Microsoft-® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution
Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its BroadcomÃ-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the MicrosoftÃ-® Mediaroom(TM)...
Read More »Low-Power Semiconductor Technology promotes energy efficiency.
Combining SOI (Silicon-on-Insulator) substrate technology with 0.16 micron lithography, next-generation variation of BCD (Bipolar-CMOS-DMOS) smart power semiconductor technology aims to reduce power consumption of electronic systems. It will enable chip designers to combine high-density logic circuitry (1.8 and 3.3 V CMOS) with full dielectric isolation and component portfolio, including power...
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Precision Fabricating with Over 40 Years of Experience
Quality Sheet Metal specializes in delivering precision, value, and customer service. With a client base that spans many diverse industries and a reputation for excellence that goes back over four decades, our clients know that we can provide the optimal combination of value and flexibility regardless of the challenge. See our video to learn what we can do for you. Through investments in state-of-the-art design, manufacturing, and quality control systems, Quality Sheet Metal remains focused on maintaining a high standard of quality, customer service, and competitive pricing. With an emphasis on customer satisfaction, Quality Sheet Metal is dedicated to establishing long-term partnerships, similar to the ones they currently have with their valued clients. If you're looking for a new partner with extensive capabilities in sheet metal fabricating and finishing, look no further.
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