Semiconductors

ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers

ANSYS power, noise and reliability solutions assist power-efficient IP design for ARM PITTSBURGH - ANSYS (NASDAQ: ANSS) has licensed its engineering simulation software tools to ARM (LON: ARM; Nasdaq: ARMH), the world's leading semiconductor intellectual property (IP) company for power efficiency, performance and reliability. The agreement will aid the ARM ecosystem and ARM-® processor...

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Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014

Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs SAN JOSE, Calif.- – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.-  Altera experts in...

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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

SHANGHAI, -- VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class, custom silicon solutions and semiconductor IP provider, announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles. Both products are...

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Broadcom Completes World's First Microsoft® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution

Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its Broadcom-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the Microsoft-® Mediaroom(TM) wireless client...

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Low-Power Semiconductor Technology promotes energy efficiency.

Combining SOI (Silicon-on-Insulator) substrate technology with 0.16 micron lithography, next-generation variation of BCD (Bipolar-CMOS-DMOS) smart power semiconductor technology aims to reduce power consumption of electronic systems. It will enable chip designers to combine high-density logic circuitry (1.8 and 3.3 V CMOS) with full dielectric isolation and component portfolio, including power...

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Wireless Sensors Push Smart Machines into Green Revolution

STMicroelectronics, ARaymond and Micropelt to Demonstrate Thermal-Energy Harvesting Solutions at Hannover Fair - Hall 8, D26 GENEVA, GRENOBLE, France and FREIBURG, Germany - STMicroelectronics (NYSE: STM), ARaymond and Micropelt today announced that they are jointly presenting thermal-energy harvesting-based solutions to power 'smart sensors' and 'smart microsystems' at the Hannover Fair under...

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SPiDCOM Successfully Demonstrates Omega's 1Gbps PLC Technology

PARIS-- SPiDCOM Technologies, Leader of the PLC (Powerline Communication) Work Package of the OMEGA European Research Project, is Paving the way for its Future Gigabit Class SoC Starting in January 2008, OMEGA is a European research project whose aim is to develop the next generation of home networking. Its innovation dwells in the creation of a multiple-technology gigabit network based on...

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New Isolated DC-DC Converter Development Tools Increase Power Density of Modular and Embedded Power Supplies

New Isolated DC-DC Converter Development Tools Increase Power Density of Modular and Embedded Power Supplies

National Semiconductor, Silicon Labs Offer Reference Design and Evaluation Board for Networking and Communications Applications SANTA CLARA, Calif. and AUSTIN, Texas -National Semiconductor Corp. (NYSE:NSM) and Silicon Laboratories Inc. (Nasdaq:SLAB) today announced a new quarter-brick isolated DC-DC converter evaluation board and reference design to help power supply designers get higher power...

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RF Micro Devices® Features Ember ZigBee® Technology in New Family of High Performance Front End Modules for Smart Energy Applications

GREENSBORO, N.C., and BOSTON, - RF Micro Devices, Inc. (Nasdaq: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today it is teaming with Ember Corporation to introduce ZigBee® front end modules (FEMs) for smart grid applications that give utilities and consumers more control over how they...

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