Semiconductors

ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers

ANSYS power, noise and reliability solutions assist power-efficient IP design for ARM PITTSBURGH - ANSYS (NASDAQ: ANSS) has licensed its engineering simulation software tools to ARM (LON: ARM; Nasdaq: ARMH), the world's leading semiconductor intellectual property (IP) company for power efficiency, performance and reliability. The agreement will aid the ARM ecosystem and ARMÂ-® processor...

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Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014

Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs SAN JOSE, Calif.Â- – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.Â-  Altera experts in...

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STMicroelectronics and Soundchip Introduce Components to Create Smart High-Definition Audio Accessories that Dazzle

Powerful new audio engines combined with high-performance MEMS microphones enable feature-rich, software-controlled headsets that take personal audio to the next level Geneva, Switzerland – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance audio ICs, together with Soundchip,...

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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

SHANGHAI, -- VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class, custom silicon solutions and semiconductor IP provider, announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles. Both products are...

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MagnaChip to Offer Cost Competitive Copper Wire Bonding

SEOUL, South Korea - MagnaChip Semiconductor Corporation ( MagnaChip Semiconductor ) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers cost competitive and state of the art copper wire bonding technology for the specialized needs of foundry customers. Copper bonding employs copper wires instead of gold for...

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ECG/EEG Analog Front Ends offer on-chip respiration measurement.

By integrating 44 discrete components, 24-bit ADS1298R Series facilitates implementation of respiration detection in portable ECG equipment. Devices provide respiration impedance at resolution of 20 mW, enabling accurate monitoring and correlation of patient respiration to ECG abnormalities. Housed in 8 x 8 mm BGA package with 4, 6, or 8 channels, AFEs use only 750 Â-µW/channel with multiple...

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Broadcom Completes World's First Microsoft-® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution

Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its BroadcomÂ-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the MicrosoftÂ-® Mediaroom(TM)...

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Low-Power Semiconductor Technology promotes energy efficiency.

Combining SOI (Silicon-on-Insulator) substrate technology with 0.16 micron lithography, next-generation variation of BCD (Bipolar-CMOS-DMOS) smart power semiconductor technology aims to reduce power consumption of electronic systems. It will enable chip designers to combine high-density logic circuitry (1.8 and 3.3 V CMOS) with full dielectric isolation and component portfolio, including power...

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