Capillary is suited for fine pitch wire bonding.
Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.
Read More »Vicor V-·I Chip Components Reduce Energy Costs
Increase Efficiency and Power Density Andover, MA, November 13, 2006...Vicor Corporation (NASDAQ: VICR) today announced the availability of a full family of VÃ-·I Chip(TM) components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or 'factorizes' regulation and voltage transformation functions into flexible, high-performance building blocks. VÃ-·I...
Read More »EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry
EV Group (EVG), based in SchÃ-¤rding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and...
Read More »BOC Edwards and Aviza Technology Announce Joint Development Agreement for Atomic Layer Deposition
JDA Combines BOC Edwards' Expertise in Chemical Precursor Formulation with Aviza's ALD Hardware Technology to Enhance Utilization, Throughput and Reduce Process Cost WILMINGTON, MASS. and SCOTTS VALLEY, CALIF. (30 October 2006)-BOC Edwards, a leading supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology, Inc. (NASDAQ:...
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Advantages of Using Robotics in Manufacturing to Attract and Retain Skilled Workers
This white paper provides an overview into the advantages of using robotics in manufacturing to attract and retain skilled workers.
Read More »Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers
Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven Lithography Solutions SAN JOSE, Calif., Sept. 19 /-- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity...
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Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment
Extending the life of manufacturing equipment, reducing downtime and eliminating contamination Morgan Advanced Ceramics, a leading manufacturer of innovative ceramic, glass, metal and engineered coating solutions, offers Performance Silicon Carbide (SiC) for semiconductor processing equipment manufacturing. Performance SiC is available in two grades, ultrapure and low electrical resistivity....
Read More »New Tools from DEK Enable 25 Micron Backside Wafer Coating at High-Speed
Fueled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultra-thin die attach materials down to 25 microns in thickness. Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per...
Read More »Semitool's New Raider-® Platform Used by Casio to Increase Lead-Free Capacity for 300mm Wafer-Level Packaging
Semitool Delivers Follow-on Raider for 300mm Lead-Free Electroplating KALISPELL, Mont., Dec. 5 -- Semitool, Inc. (NASDAQ:SMTL), a leading manufacturer of advanced single-wafer deposition and surface preparation process equipment for the semiconductor and wafer-level packaging industry, today announced the delivery of a follow-on order for Semitool's electroplating Raider tool by Japan-based Casio...
Read More »Analyzer facilitates lithography cell qualification.
Integrated with Archer overlay, eCD CD SEM, and SpectraCD optical CD metrology platforms for 65 nm and below IC production, K-T Analyzer lithography correctable platform provides automated, on-tool analysis of overlay and critical dimension metrology data in real time. System gives engineers immediate feedback on quality of lithography process, enabling them to correct errors, minimize...
Read More »Luminescent to Provide Enabling Lithography Platform to Cypress's Silicon Valley Technology Center
SVTC and Luminescent to Jointly Develop New Manufacturing Approach Using Inverse Lithography Technology (ILT) MOUNTAIN VIEW, Calif. and SAN JOSE, Calif., Oct. 3 -- Luminescent Technologies, Inc. and Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp. (NYSE:CY) today announced a joint development program in which the companies will collaborate on advanced lithography...
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Cut and Bevel Pipe up to 63" Diameter with a Single Lightweight, Portable Machine
CS Unitec is a leader in power tools designed for industrial applications, with products that set the standard for robust performance and industry-leading reliability. Adding to our long list of innovation is a new line of pipe cutting machines. For cutting and beveling pipe up to 2" in thickness and diameters from 12" to 63", no other cutting system comes close. See our video to learn more.
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