Semiconductor Processing Equipment

Semiconductor Processing Equipment

Semiconductor Processing Tool minimizes plama-induced damage.

Targeted for 2xnm and below etch applications, Primo iDEA™ integrates 4 dielectric etch stations and 2 photoresist strip chambers onto same platform. Integrative approach enables optimization of each process stepÂ- and minimizes risk of plasma-induced damage. With dedicated dielectric etch and downstream ashing capabilities, offering is optimal for FEOL and BEOL applications...

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Speedline's MPM® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction Problems
Semiconductor Processing Equipment

Speedline's MPM® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction Problems

Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPM® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market...

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Semiconductor Processing Equipment

Electron Beam Metallization System suits 100 and 150 mm wafers.

Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...

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Reticle Inspection System monitors sub-20 nm design nodes.
Semiconductor Processing Equipment

Reticle Inspection System monitors sub-20 nm design nodes.

With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects,Â- such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also...

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Semiconductor Processing Equipment

Batch Wet Processing System optimizes metal lift-off.

Using patented batch immersion processing for metal lift-off in MEMS and compound semiconductor manufacturing, FluidJet™ System produces no metal redeposition on either front side or back side of wafer, eliminating device damage while minimizing chemical use. Self cleaning tanks and metal collection baskets enable lifted metals to be completely reclaimed. Emptied in minutes, strainer baskets...

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Photoresist Processing System provides conformal coating.
Semiconductor Processing Equipment

Photoresist Processing System provides conformal coating.

Available on EVG150XT Resist Coating System for high-volume manufacturing semiconductor applications, NanoSpray provides conformal coating of structures that have vertical sidewall angles, such as through-silicon vias, through-glass vias, and through-substrate vias used for 2.5D interposers and 3D-ICs. NanoSpray can deposit polymer liners ranging from 1–20 microns thick, minimizing mechanical...

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Semiconductor Processing Equipment

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

EVG® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for...

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Semiconductor Processing Equipment

QuantumClean® and ChemTrace® to Exhibit at SEMICON Korea 2014

Global Leader in Semiconductor High Purity Process Parts Cleaning, Performance Coatings and Microcontamination Analytical Laboratory Services™ to exhibit at SEMICON Korea 2014 tradeshow. QUAKERTOWN, Pa. - QuantumClean® and ChemTrace® today announced that they will be exhibiting at the SEMICON Korea tradeshow, held at the Coex in Seoul, South Korea from February 12(th) through...

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MEI Wet Processing Systems and Services Enters Taiwanese Market with Advanced Etch Solution
Semiconductor Processing Equipment

MEI Wet Processing Systems and Services Enters Taiwanese Market with Advanced Etch Solution

ALBANY, Ore.Â- — MEI Wet Processing Systems and Services (an MEI LLC Company) announced today that it has received an order from a Taiwan based customer for its Advanced Etch Solution, based on MEIs Revolution Wet Processing System, a semi-automated rotary wet processing system designed for batch wet processing (etch or solvent) for Semiconductor and MEMs applications. This shipment marks...

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Semiconductor Processing Equipment

SUSS MicroTec Honored with Amkor Technology's "2013 Best of Class Equipment Award"

Garching — SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the 2013 Best of Class Equipment Award" from Amkor Technology on October 18, 2013. Every year the most successful suppliers of Amkor receive this award. SUSS MicroTec was especially honored for its lithography equipment and process solutions for the...

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