Semiconductor Processing Tool minimizes plama-induced damage.
Targeted for 2xnm and below etch applications, Primo iDEA™ integrates 4 dielectric etch stations and 2 photoresist strip chambers onto same platform. Integrative approach enables optimization of each process step- and minimizes risk of plasma-induced damage. With dedicated dielectric etch and downstream ashing capabilities, offering is optimal for FEOL and BEOL applications involved in...
Read More »Semiconductor Processing Tool minimizes plama-induced damage.
Targeted for 2xnm and below etch applications, Primo iDEA™ integrates 4 dielectric etch stations and 2 photoresist strip chambers onto same platform. Integrative approach enables optimization of each process stepÃ- andÃÂ minimizes risk of plasma-induced damage. With dedicated dielectric etch and downstream ashing capabilities, offering is optimal for FEOL and BEOL applications involved...
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Speedline's MPM® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction Problems
Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPM-® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market more...
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Speedline's MPM-® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction Problems
Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPMÃ-® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market...
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Key Benefits of a Full Service Semi-Finish Manufacturer
Check out this white paper to learn what to look for in a manufacturer of rotating parts.
Read More »Electron Beam Metallization System suits 100 and 150 mm wafers.
Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...
Read More »Electron Beam Metallization System suits 100 and 150 mm wafers.
Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping...
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Reticle Inspection System monitors sub-20 nm design nodes.
With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects,- such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also use...
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Reticle Inspection System monitors sub-20 nm design nodes.
With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects,Ã- such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also...
Read More »Batch Wet Processing System optimizes metal lift-off.
Using patented batch immersion processing for metal lift-off in MEMS and compound semiconductor manufacturing, FluidJet™ System produces no metal redeposition on either front side or back side of wafer, eliminating device damage while minimizing chemical use. Self cleaning tanks and metal collection baskets enable lifted metals to be completely reclaimed. Emptied in minutes, strainer baskets...
Read More »Batch Wet Processing System optimizes metal lift-off.
Using patented batch immersion processing for metal lift-off in MEMS and compound semiconductor manufacturing, FluidJet™ System produces no metal redeposition on either front side or back side of wafer, eliminating device damage while minimizing chemical use. Self cleaning tanks and metal collection baskets enable lifted metals to be completely reclaimed. Emptied in minutes, strainer baskets...
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5 and 13 Micron Resolve Columns with Greater Bed Stability
Jordi Labs provides materials solutions that set the standard for innovation and quality. Our line of GPC and GFC columns are on the cutting edge of precision manufacturing and a result of our uncompromising commitment to quality and customer service. See our video to learn more.
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