Sound Dampener limits inter-room noise transmission.

Used in new construction or retrofit applications, PROSPEC Decibel Drop™ viscoelastic damping compound decreases sound traveling to adjacent rooms. Class 1 fire-rated product has sound transmission class rating of 50–62, depending on construction configuration; and comes in cartridges for application with caulk gun. Product installs between layers of drywall or plywood in walls and ceilings...

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Damping Compound provides noise control.

Visco-Elastic Green Glue minimizes transference of sound vibration and is commonly used in constrained layer damping system, where it is sandwiched between 2 sheets of drywall, plywood, or subflooring. When resulting sandwich is vibrated, shear forces pull and stretch on damping material, allowing it to dissipate energy. Green Glue can work in conjunction with other acoustical materials such as...

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Ashland Introduces Powder-Prime Capable SMC Resin/Adhesive System

DUBLIN, Ohio - New technology from within Ashland Performance Materials has developed a powder-prime capable sheet molding compound (SMC) formulation and adhesive for automotive component assembly. A first for the automobile industry, this system was developed by Ashland Composite Polymers and Ashland Specialty Polymers & Adhesives, business groups of Ashland Performance Materials, a division of...

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Fine-Diameter Reinforcement works with existing resins.

Offering reinforcement filaments with diameters of 6 and 7 microns, MicroMax(TM) chopped strand provides positive aid for miniaturization of electronic components. Reinforcement solution, suited for parts down to 0.15 mm thick, helps reduce reinforcement loading without compromising part strength or stiffness. Minimal outgassing results in cleaner mold surfaces, reduced risk to active components,...

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Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer

Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer

When a U.S. safe manufacturer / fabricator recently converted from liquid coating (spray paint) to powder coating, they faced one obstacle: the two-part epoxy based fillers used to cosmetically patch and fill their rough welds and seams failed in the heat of powder coating ovens. After successfully testing Lab-metal and Hi-Temp Lab-metal, one-part metal repair and patching compounds from Alvin...

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Moldable Material suits insulating and patching needs.

Moldable Material suits insulating and patching needs.

Superfil 607 Moldable wet mastic material is designed for continuous use up to 2,000Â-ºF, and has smooth, semi-sticky consistency for application to refractory and fibrous surfaces. It is supplied ready-to-use from pail or caulking tube and used for repair and reinsulation of furnace lining cracks as well as for covering metal hardware. Non-wetting to molten aluminum makes it suited for...

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Etch Compound provides surface profile on old concrete.

Safer for use than hydrochloric or muriatic acid, low-odor Superior Safety Etch comes in gel form for optimal uniformity. Water-based, non-flammable product is non-ozone depleting and contains no Toxic/Hazardous Air Pollutants. Clean up is with soap and water or denatured alcohol. Superior Safety Etch covers 200-300 sq-ft/gal and is suitable for green and mature concrete, factory and warehouse...

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TPE Alloys minimize oxygen and moisture vapor transmission.

TPE Alloys minimize oxygen and moisture vapor transmission.

Design to extend products' shelf-life, TPE alloys provide barrier to oxygen and moisture vapor transmission in food, beverage, and medical packaging industry applications. Some grades are translucent, and technology ranges in hardness from Shore A 40-90. Standard TPE oxygen barrier is typically in the range of 50,000-90,000 cc.mil/m-².day.atm @ 23C, and moisture vapor transmission rate (MVTR)...

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New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages

Irvine, California, August 8, 2006 New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices. Uniting the robust performance characteristics of die attach...

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Compound suits thin and ultra-thin SMD applications.

HysolÂ-® QMI529LS die attach material combined with HysolÂ-® GR828A mold compound delivers properties necessary to provide material set for packages used in low-profile products such as cell phones and portable music players. Formulation of Hysol QMI529LS provides hydrophobic properties, while delivering stability at extremely high temperatures. Tested to JEDEC Level 1, 260Â-

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