Silicone Compound is electrically conductive.

Silicone Compound is electrically conductive.

Suited for bonding and sealing applications, 2-component, graphite-filled Master Sil 155 has 1:1 mix ratio by weight and cures at ambient temperatures or with heat. Controlled viscosity of silicone elastomer formulation produces smooth paste for complete fill-in around complicated contours. Compound exhibits elongation greater than 300%, resistance to shock and vibration, and less than 0.15%...

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Polypropylene Compound offers ESD protection.

Nexstat-10C896 static dissipative polypropylene compound can be molded with consistent resistivity in range of 106-109 ohms/sq. It protects static sensitive components from damage caused by field induced voltages. Recyclable compound has low ionic contamination, low out gassing, and minimal sloughing. Product suits manufacture of static protective storage bins, tote boxes, guide rails,...

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Compounds provide electrical conductivity.

Compounds provide electrical conductivity.

PRE-ELEC compounds are based on chopped carbon fiber, milled carbon fiber, and carbon nanotubes. They are available with as much as 60% carbon fiber in nylon 6/66 and PPS, and at least 40% in others, including PP, ABS, PC, POM, and PSul. Compounds based on milled carbon fiber are less prone to warpage, while compounds that are based on carbon nanotubes can be electrically conductive with as...

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Molding Compounds are suited for hearing aid fabrication.

Available in 14 low-viscosity and 8 high-viscosity verisons, LoctiteÂ-® ResinAid molding compounds are offered in various colors to closely match natural skin tones. Compounds comply with ISO-10993 standards for skin surface medical devices. Line also includes 9 adhesive formulations for bonding shell components. Batch curing chamber, LoctiteÂ-® ResinAid Shell Curing System, light cures...

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Molding Compound suits harsh under-the-hood applications.

HysolÂ-® GR725-AG non-antimony/non-bromine/non-phosphorous semiconductor molding compound is suited for automotive applications. It replaces epoxy molding compounds containing brominated flame retardants and antimony trioxide, which can degrade gold wire/aluminum pad interconnects at elevated temperatures. Compound incorporates transition metal oxides and is suitable for use in Power SO...

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Repair Compund is designed for marine use.

Repair Compund is designed for marine use.

Used above or below water on vessel's surface, Marine Repair Compound consists of 2-part epoxy that can be painted and sanded. Product repairs anything from fiberglass and plastic to aluminum and wood and also aids in procedures such as bolt or cleat repair and installation. It dries white and cures in 2-4 hr, depending on temperature. Also available, acrylic version is offered for making repairs...

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Epoxy Mold Compound suits SIP applications.

HysolÂ-® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Â-

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Potting/Encapsulation Compound resists thermal shock.

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155Â-

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