Vishay Intertechnology to Showcase Latest Industry-Leading Technologies at 2013 CEF Summer Chengdu Show
SHANGHAI — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2013 CEF (China Electronics Fair) Summer Chengdu show, taking place June 20-22 at the Chengdu Century City New International Convention and Exhibition Center. In hall 3, booth A214, the company will be highlighting its latest industry-leading innovations, including passive components, diodes, power...
Read More »Texas Instruments Builds Upon Leadership in Millimeter Wave Circuits for Short-Range Sensors
DALLAS- – This week at the 2013 VLSI Symposium in Kyoto, Japan, Texas Instruments Incorporated (TI) (NASDAQ: TXN) will demonstrate an industry first in millimeter wave circuits with a paper on a 160GHz center-frequency-pulsed transmitter for short-range sensor applications.- The transmitter features a higher effective isotropic radiated power (EIRP) at sub-THz frequencies than previous...
Read More »Sub-Harmonic Pumped Mixer requires no biasing.
Housed in 1.5 x 1.2 mm plastic TDFN surface mount package, Model MAMX-011009 covers frequency range of 14–32 GHz and IF frequencies from DC to 7 GHz. Broadband mixer has single RF port, requires no biasing, and has optimized 2xLO and 3xLO isolation, eliminating need for extra filtering. Requiring +15 dBm of LO power, which can be attained by implementing 4-20 GHz buffer amplifier, mixer...
Read More »TI Fast-Charge Technology Gets More Life Out of a Li-Ion Battery
New battery fuel gauge and charger chipsets with MaxLife™ technology allow consumers to charge faster without degrading the battery DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two power management chipsets with TI's patented new MaxLife™ fast-charge technology, which allows consumers to charge single-cell Li-Ion batteries faster and experience longer battery...
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How Is Expanded Metal Foil Made?
Expanded metal foil is a lightweight coil of metal that has been slit and stretched to create a uniform mesh pattern of openings.
Read More »ASUS Selects Cavium's PureVu® SoC for Its Wireless Display Adapter for ASUS MeMO Pad FHD10 Tablets
News Highlights: • Optimized For Both Form (Stick form-factor) and Function (Support for Wi-Fi Display and DLNA®) • Leverages Cavium's Award Winning PureVu CNW6611L for its Superior Performance, Low Power Consumption, and Competitive Cost Structure •- Enables 1080p resolution powered by media SoC and supported by a 2x2 802.11n MIMO radio SAN JOSE, Calif. –- Cavium, Inc. (NASDAQ: CAVM),...
Read More »Made in IBM Labs: IBM Scientists Unveil Highly Integrated Millimeter-Wave Transceiver for Mobile Communications and Radar Imaging Applications
Researchers invent solution that seamlessly brings together 4 integrated chips and 64 antennas in a single package for mobile and transportation solutions Proven SiGe BiCMOS prototype takes advantage of under-utilized short-wavelength frequency SEATTLE - Scientists from IBM (NYSE: IBM) have achieved a milestone in creating a phased-array transceiver that contains all of the millimeter-wave...
Read More »Texas Instruments Transforms the Economics of Small Cells
New KeyStone-based SoC offers best power/performance for indoor enterprise PoE+ small cells and outdoor pico deployments, enabling manufacturers to address simultaneous dual mode and carrier aggregation with one scalable solution LONDON - SMALL CELLS WORLD SUMMIT - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry's most power and BOM optimized small cell solution...
Read More »Scintera Networks Engages with Freescale for Low Power Small Cell RF Technology
SUNNYVALE, Calif.- – Scintera Networks, Inc. announces that it has engaged with Freescale Semiconductor® (NYSE: FSL), a leading provider of RF power solutions for wireless communications, to enable low power and cost-efficient solutions for the small cell base station market. As part of the engagement, Freescale will design and optimize new small cell RF power amplifier devices and evaluation...
Read More »Toshiba Expands High Power C-Band GaN HEMT Product Line to Support the SATCOM Market
Optimized for High Power, Gain and Efficiency to Support Extended C-Band Applications SEATTLE - 2013 INTERNATIONAL MICROWAVE SYMPOSIUM, Booth #2027 - Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, and its parent company, Toshiba Corp., today announced the expansion of its gallium nitride high...
Read More »Arteris FlexNoC Network-on-Chip Technology Designed into Majority of Mobile SoCs
FlexNoC® interconnect fabric used in over 60 percent of market-leading application processors and LTE modems AUSTIN, Texas - DESIGN AUTOMATION CONFERENCE - Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that its FlexNoC interconnect fabric IP was used in a majority of chips developed in 2011 and 2012,...
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560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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