Circuits

Vishay Intertechnology to Showcase Latest Industry-Leading Technologies at 2013 CEF Summer Chengdu Show

SHANGHAI — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2013 CEF (China Electronics Fair) Summer Chengdu show, taking place June 20-22 at the Chengdu Century City New International Convention and Exhibition Center. In hall 3, booth A214, the company will be highlighting its latest industry-leading innovations, including passive components, diodes, power...

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Texas Instruments Builds Upon Leadership in Millimeter Wave Circuits for Short-Range Sensors

DALLAS- – This week at the 2013 VLSI Symposium in Kyoto, Japan, Texas Instruments Incorporated (TI) (NASDAQ: TXN) will demonstrate an industry first in millimeter wave circuits with a paper on a 160GHz center-frequency-pulsed transmitter for short-range sensor applications.-  The transmitter features a higher effective isotropic radiated power (EIRP) at sub-THz frequencies than previous...

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Sub-Harmonic Pumped Mixer requires no biasing.

Housed in 1.5 x 1.2 mm plastic TDFN surface mount package, Model MAMX-011009 covers frequency range of 14–32 GHz and IF frequencies from DC to 7 GHz. Broadband mixer has single RF port, requires no biasing, and has optimized 2xLO and 3xLO isolation, eliminating need for extra filtering. Requiring +15 dBm of LO power, which can be attained by implementing 4-20 GHz buffer amplifier, mixer...

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TI Fast-Charge Technology Gets More Life Out of a Li-Ion Battery

New battery fuel gauge and charger chipsets with MaxLife™ technology allow consumers to charge faster without degrading the battery DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two power management chipsets with TI's patented new MaxLife™ fast-charge technology, which allows consumers to charge single-cell Li-Ion batteries faster and experience longer battery...

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ASUS Selects Cavium's PureVu® SoC for Its Wireless Display Adapter for ASUS MeMO Pad FHD10 Tablets

News Highlights: • Optimized For Both Form (Stick form-factor) and Function (Support for Wi-Fi Display and DLNA®) • Leverages Cavium's Award Winning PureVu CNW6611L for its Superior Performance, Low Power Consumption, and Competitive Cost Structure •- Enables 1080p resolution powered by media SoC and supported by a 2x2 802.11n MIMO radio SAN JOSE, Calif. –- Cavium, Inc. (NASDAQ: CAVM),...

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Made in IBM Labs: IBM Scientists Unveil Highly Integrated Millimeter-Wave Transceiver for Mobile Communications and Radar Imaging Applications

Researchers invent solution that seamlessly brings together 4 integrated chips and 64 antennas in a single package for mobile and transportation solutions Proven SiGe BiCMOS prototype takes advantage of under-utilized short-wavelength frequency SEATTLE - Scientists from IBM (NYSE: IBM) have achieved a milestone in creating a phased-array transceiver that contains all of the millimeter-wave...

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Texas Instruments Transforms the Economics of Small Cells

New KeyStone-based SoC offers best power/performance for indoor enterprise PoE+ small cells and outdoor pico deployments, enabling manufacturers to address simultaneous dual mode and carrier aggregation with one scalable solution LONDON - SMALL CELLS WORLD SUMMIT - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry's most power and BOM optimized small cell solution...

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Scintera Networks Engages with Freescale for Low Power Small Cell RF Technology

SUNNYVALE, Calif.- – Scintera Networks, Inc. announces that it has engaged with Freescale Semiconductor® (NYSE: FSL), a leading provider of RF power solutions for wireless communications, to enable low power and cost-efficient solutions for the small cell base station market. As part of the engagement, Freescale will design and optimize new small cell RF power amplifier devices and evaluation...

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Toshiba Expands High Power C-Band GaN HEMT Product Line to Support the SATCOM Market

Optimized for High Power, Gain and Efficiency to Support Extended C-Band Applications SEATTLE - 2013 INTERNATIONAL MICROWAVE SYMPOSIUM, Booth #2027 - Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, and its parent company, Toshiba Corp., today announced the expansion of its gallium nitride high...

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Arteris FlexNoC Network-on-Chip Technology Designed into Majority of Mobile SoCs

FlexNoC® interconnect fabric used in over 60 percent of market-leading application processors and LTE modems AUSTIN, Texas - DESIGN AUTOMATION CONFERENCE - Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that its FlexNoC interconnect fabric IP was used in a majority of chips developed in 2011 and 2012,...

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