Renesas' Intersil Brand ICs Blast Off Onboard the Mars 2020 Perseverance Rover Mission to the Red Planet
NASA’s Latest Mars Rover Enabled by Intersil Radiation-Hardened Technology TOKYO, Japan, August 6, 2020 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that more than 20 of its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the July 30 lift off of NASA's Mars 2020 Perseverance rover. A United...
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New HFR DDIC Product Line Provides Vivid and Smooth Visual Experience for Users
Improves the image quality by increasing the number of frames used per second. Available with optimal frame rates of FHD+ at 144 Hz and QHD+ at 120 Hz.
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New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
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6 Engineering & High-Performance Plastics Used for Machined Components
This resource breaks down six of the most commonly used high-performance plastics, properties and common applications, and questions to ask during material selection.
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New P10 PLC Integrated Circuit Comes with Keypad and Display Interface
Features Ethernet communications, enhanced counter/timer functionality, I2C ports, SPI ports, quadrature counter and accelerated scan times. Offers up to 106 digital I/O, up to 8 12-bit analog inputs and one 10-bit analog output, integrated real time clock and SD card interface. Temperature ranges from -40 to 85°C and can be embedded in electro- hydraulic and mobile equipment, motor drives,...
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New Power Management ICs Feature Multiple Output Power Rails
EFP01 PMIC simplifies power system design and reduce power consumption through improved control. Includes low-voltage DC-DC converters and regulators along with a flexible mechanism to manage the power rails in a system design. Ideal for IoT sensors, asset tags, smart meters, home and building automation, security and health and wellness products.
Read More »New MAX77654 Power Management IC with Long Battery Life
Delivers 3 outputs with just one inductor at 91 percent efficiency. Addresses space-constraint challenges for system designers by replacing 3 buck-boost converters, 3 inductors with a single converter and a single inductor. Yields lower heat dissipation and reduce system board temperature by more than 20 degrees Celsius.
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New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
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Molex Meets the Needs of Engineers 4.0 by Releasing its New Micro Fit Product Range on Traceparts.com
The world-renowned electronics solutions provider offers a wide range of connectors suitable for all types of applications. Saint-Romain, France – April 02, 2020 – As a leading supplier of electronic components and solutions, Molex sees innovation as a tool for solving its customers’ most complex problems. The Molex Micro-Fit product line is available in multiple circuit sizes and cable...
Read More »New MIPI C-PHY/D-PHY IP Provides Fast Connectivity in Mobile and Automotive Applications
Delivers less than 1.3pJ/bit, operating at 24 Gb/s, for optimal energy consumption in high-resolution imaging devices. Offers comprehensive built-in test capabilities, including pattern generator, logic analyzer and loopback modes covering all circuits. Enables 4K and beyond displays and 100-megapixel cameras with support for up to 4.5 Gb/s per lane maximum speed in D-PHY configuration and 3.5...
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Standex Engraving Mold-Tech Offers Nickel Shell Capabilities on a Global Scale
Standex Engraving Mold-Tech is the premier, global supplier for mold texturing and surface finishing. With a full range of services, Standex Engraving Mold-Tech is also the only nickel shell supplier producing in three global locations. See our video to learn more.
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