Circuits

ALi STB Chipsets Integrated with Middleware from ACCESS STB Labs to Provide Value-added Services and Applications

Bangalore and Taipei –- ALi Corporation, a leading Set-Top Box (STB) solution provider, today announced that ALi’s STB chipsets have incorporated middleware solutions from ACCESS STB Labs, a media and entertainment software development company based in Bangalore, India, offering end-to-end innovative and cost-effective solutions for Digital TV market. Every market is looking to optimize ARPU...

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Future Electronics Offers Availability of Digi International ConnectCore Modules

Pointe Claire, Quebec- – Future Electronics, a global leading distributor of electronic components, is pleased to announce availability of ConnectCore Modules from Digi International. The ConnectCore i.MX51 module family comprises high performance 800 MHz frequency 128 MB for Flash and 128 RAM Memory 802.11 Standard Core Wi-Fi. These modules combine the fast integration, reliability and design...

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Half-Bridge Gate Driver IC features programmable dead time.

Half-Bridge Gate Driver IC features programmable dead time.

Available in 14-pin SOIC- and 14-lead DIP packages, IX21844 can drive – in half-bridge, full-bridge, and 3-phase configurations – discrete power MOSFETs and IGBTs that operate up to 600 V. Both high and low side outputs feature integrated power DMOS transistors, each capable of sourcing 1.4 A and sinking 1.8 A gate drive current. Absolute maximum rating of 700 V- provides additional margin...

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Discrete Serial Link Aggregator ICs support data rates to 10 Gbps.

Using 2 power rails, 1- to 8-channel TLK10081- and 2-channel TLK10022 aggregate and de-aggregate point-to-point serial data streams for transmission over backplanes, copper cables, and optical links. Features include intelligent serial link switching and- built-in digital equalization. While TLK10022 supports 4:1, 3:1, and 2:1 bidirectional serial link configurations, TLK10081 manages 8:1...

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Single Supply LDOs feature max dropout voltage of 140 mV.

Supporting 2 and 3 A loads, Models XRP6274 and XRP6275 operate with low voltage rails of 1.1–2.5 V, providing single supply solution for point-of-load voltage regulation. Units achieve ultra low dropout performance without external bias voltage or internal charge pump. Startup is guaranteed from input voltage as low as 1.045 V. Using ceramic capacitors, devices provide output voltages down to...

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Leading European Service Provider SFR Launches Hybrid Set-Top Box for Both Broadcasting and Streaming with Google Services for Smart TV Powered by Marvell's ARMADA 1500 Plus HD Media Platform

Marvell's award-winning SoC platform powers Europe's first hybrid set-top box offering Google services for Smart TV SANTA CLARA, Calif. - Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that European leading service provider, SFR, has launched its hybrid set-top box powered by Marvell's ARMADA-® 1500 Plus (88DE3108) system-on-chip (SoC) platform. The...

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A/D Converters support multi-channel data acquisition.

Integrating 16 channels into single package, Model AD9249 dissipates 58 mW of power per channel at 65 MSPS, while 8-channel Model ADS9681 dissipates 110 mW per channel at 125 MSPS. Both 14-bit units are available in 10 x 10 mm package- with- on-chip sample-and-hold circuit. DACs- achieve spurious free dynamic range greater than 90 dBc and signal-to-noise ratio of 74 dBFS or better. Both can be...

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Dual Photovoltaic MOSFET Driver replaces discrete solutions.

Dual Photovoltaic MOSFET Driver replaces discrete solutions.

Featuring optically coupled technology that provides 3,750 Vrms input to output isolation, FDA217 can achieve 27 -µA short circuit current with input LED current of 30 mA. Each independent driver consists of LED optically coupled to photodiode array, and each array can generate open circuit voltage of 12.2 V and short circuit current of 9.1 -µA with forward LED current of 10 mA. Driver output...

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Wi-Fi Modules target M2M and Internet of Things markets.

Wi-Fi Modules target M2M and Internet of Things markets.

Measuring 8 x 8 mm, EC19D SiP Modules can be embedded in almost any product or application, enabling product designers to quickly connect devices to 802.11b/g/n Wi-Fi networks. Modules feature Wi-Fi Direct, ProbMe™ configuration, full TCP/IP stack, HTTPS/SSL, DHCP Client/Server, and WPS, as well as legacy Wi-Fi Client and SoftAP modes with WPA/WPA2 support, Serial to Wi-Fi, and Cloud Service...

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