Circuits

CES 2014: Altair Semiconductor Partners with Ecrio for Commercial VoLTE Solution

Chipset with Embedded FlexIMS™ Software to Support Rapid Expansion of VoLTE Globally LAS VEGAS - Altair Semiconductor, the world's leading developer of high-performance, single-mode LTE chipsets, and Ecrio, the leading provider of 4G LTE real time communications client software for the mobile industry, today announced a partnership to provide an integrated solution bringing together Altair's...

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Jungo to Demonstrate Automotive Solution Based on NVIDIA Tegra Platform at CES 2014

LAS VEGAS - - Jungo's MediaCore multimedia middleware integrated with the NVIDIA Tegra automotive reference platform - Integrated solution provides the latest in-car multimedia and connectivity functionality - Product demonstrations at Jungo booth and GENIVI showcase at CES 2014 Jungo Connectivity Ltd, a leading provider of automotive middleware and connectivity solutions, today announced that it...

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ZTE's Flagship Grand Memo LTE Smartphone Achieves China Mobile TD-LTE Certification with Marvell's Industry Leading 4G LTE Solution

Marvell's ARMADA Mobile PXA1802 4G LTE modem enables ZTE's first TD-LTE smartphone now widely available for China Mobile's nearly 760 million subscribers SANTA CLARA, Calif. and LAS VEGASÂ- – Marvell (Nasdaq: MRVL) today announced that ZTE's flagship Grand Memo LTE smartphone has achieved China Mobile TD-LTE certification with Marvell's industry leading 4G LTE solution. Marvell's...

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MediaTek Adds CDMA2000 and Unveils Plans for Worldmode(TM) Mobile Chipsets

Collaboration with VIA Telecom enables a System-on-a-Chip design that supports voice and data services across mobile networks globally LAS VEGASÂ- – MediaTek today announced a collaboration with VIA Telecom to integrate its proven CDMA2000 technology into the upcoming Worldmode™ mobile platforms. The collaboration is part of MediaTek's strategy to address global markets with its...

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Single-Chip Routers deliver ADSL/VDSL2 speeds to emerging markets.

Promoting access data rates while reducing CPE expense, 28 nm BCM63381 integrates ADSL- and VDSL2-supporting G.vector technology, fast Ethernet switch, and PCIe interface for connectivity to Wi-Fi silicon in residential gateways that deliver both wired and wireless Internet access to consumers. Device combines multiple home networking technologies and software solutions in one integrated...

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SFF Ultra Low Power MCUs foster smart connectivity.

Supplied in 3 x 3 mm WLCSP featuring 49 balls with 0.4 mm pitch, SAM G series ARMÂ-® Cortex-M4-based MCUs suit sensor hub and battery-operated applications. SAM G51 and SAM G53 series consume as little as 100 Â-µA/MHz in active mode (7 Â-µA in sleep with SRAM retention), have 48 MHz frequency, and offer wake-up time down to 3 Â-µsec. Along with floating point unit (FPU) option,...

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GainSpan to Showcase Latest Wireless Connectivity Solutions for the Internet of Things at CES 2014

Company features next-generation GS2000 ultra-low power Wi-Fi and combo Wi-Fi/ZigBee IP technology LAS VEGASÂ- — CES 2014 - GainSpan Corporation, a leader in ultra-low power Wi-Fi connectivity, today announced it will showcase its latest wireless solutions for the Internet of Things at the International CES 2014, January 7-10, in Las Vegas, Nevada. The company will feature its...

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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.

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