Array includes analog and digital circuits.

Press Release Summary:



Mixed-Signal Structured Array uses single IC fabrication mask to configure array of analog and digial circuit elements into application specific integrated circuit. Digital logic, analog amplifiers, resistors, switches, and capacitors are included. Using single process layer, they are interconnected to form ASIC. Model MSSA-1 contains 24 operational transconductance amplifiers, 12 buffer amplifiers, 33 K configurable logic gates, 18 kB of ROM, and 6 kB of SRAM.



Original Press Release:



Triad Semiconductor Develops Mixed-Signal Structured Array



WINSTON-SALEM, N.C - May 4, 2004 - Triad Semiconductor, Inc., a fabless semiconductor company announced today the development of a mixed-signal structured array (MSSA). This new integrated circuit (IC) design architecture uses a single IC fabrication mask to configure an array of analog and digital circuit elements into an application specific integrated circuit (ASIC). The patent pending technology reduces ASIC development costs to a fraction of full custom designs.

The MSSA resembles well understood digital structured ASICs. Primitive circuit elements are fabricated in a structured manner in all but one of the manufacturing process steps. The fundamental difference is that the MSSA technology includes both analog and digital circuits. Digital logic, analog amplifiers, resistors, switches and capacitors are included in the array. Using a single process layer known as the "via," they are interconnected to form an ASIC. Tooling is reduced to one mask layer and the configuration step occurs late in the fabrication process, thus drastically lowering ASIC tooling costs and manufacturing time. Because the design task is to configure a known array or circuit elements, design risk and development time are also reduced.

In August of 2003, Triad Semiconductor and ViASIC, Inc. (www.viasic.com) began collaboratively developing the MSSA architecture and electronic design and automation (EDA) tool extensions to ViaPATH, ViASIC's structured ASIC design software. The first chip design using the MSSA technology is currently being fabricated.

The initial MSSA product platform, known as MSSA-1 is progressing towards production launch in October of 2004. It is being fabricated on the Austria Microsystems in a 0.35 micron 2 poly / 4 metal mixed-signal process. The MSSA-1 platform contains 24 operational transconductance amplifiers (OTAs), 12 buffer amplifiers, 33K configurable logic gates, 18K bytes of ROM and 6K bytes of SRAM.

Since founding in April of 2002, Triad Semiconductor's product developments have concentrated on mixed-signal ICs for sensor systems. With the invention of the MSSA technology, the company will be expanding to address a greater portion of the analog and mixed-signal IC market.

About Triad Semiconductor, Inc.
Triad Semiconductor, Inc. is a privately held fabless semiconductor company with proprietary mixed-signal structured array technology. The company headquarters are in the Piedmont Triad Research Park in downtown Winston-Salem, North Carolina. For more information, please visit the web site located at www.triadsemi.com or call 336-721-9450.

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