Airgo Networks' True MIMO(TM) Wireless Chipsets Power First Reliable Video Cable Replacement in Set-Top Boxes
Industry Leaders Sign On for Flawless Multimedia Multiple-Streaming Capabilities to Offer Service Providers Wireless Triple-Play Option for Data, Video and Voice TAIPEI, Taiwan, COMPUTEX, June 6 - Airgo Networks, Inc., pioneer and leader in high performance wireless technology, today announced its latest True MIMO Gen3 technology, True MIMO Media(TM), will be demonstrated during Computex, June 6...
Read More »Airgo Networks Continues to Expand True MIMO(TM) Gen3 Product Line
Delivering Next Generation MIMO Performance at Mid-Tier Prices COMPUTEX, TAIPEI, Taiwan, June 6 / - Airgo Networks, Inc., pioneer and leader in high performance wireless technology, today launched its new Mid-Tier True MIMO(TM) Gen3 chipsets at Computex, June 6 - 10, 2006 at the Grand Hyatt, Suite #1305/1306. With the new Mid-Tier True MIMO Gen3 solution, Airgo creates a new category of...
Read More »Modem Chipset supports IEEE 802.16e-2005 standard.
Comprised of 3 Stratix-® II FPGAs, Sequans SQN2110 WiMAX basestation modem chipset provides wireless OEMs with ready-made solution for developing mobile WiMAX systems. Technology provides mobile wireless connectivity without line-of-sight to basestations, cell radius of 3-10 km, and system access speeds up to 40 Mbps/channel. Stratix II FPGAs are used for medium control access and physical...
Read More »Chipset enables whole-home multimedia connectivity.
Comprising RF, analog, baseband, and MAC functions, CWave(TM) PL3100 enables whole-home distribution of HDTV content, multi-channel audio, and high-speed data across coax and wireless networks. Signal traverses existing RF splitters, coexists with legacy CATV and satellite, and requires no changes to existing wiring. Bridging wireless and wired communications, CWave enables 1 Gbps data rate...
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Epoxy Crusher Backing Solutions for Construction Aggregate & Ore Mining Applications
This white paper provides a guide to epoxy crusher backing solutions for construction aggregates and ore mining applications.
Read More »Wireless Chipsets support multiple antenna configurations.
With throughput of 180+ Mbps, Intensi-fi(TM) draft-802.11n solutions provide wireless connectivity in challenging environments while ensuring compatibility among next generation products. Chipsets combine radio and digital technologies and use Active Diversity(TM) intelligent signal processing technique. Designed to be upgradable to meet final IEEE 802.11n specification, products are...
Read More »Quellan's X-Ten Technology Extends Data Center Reach for 10 Gigabit Ethernet Links
Lane Manager Chips Yield Cable Module That Breaks 50 Meter Data Center Barrier LOS ANGELES, April 20 -- Quellan, Inc., a leading supplier of Analog semiconductors, today announced it has achieved a 200% Reach Extension for the burgeoning 10 Gigabit Ethernet Standard -- a breakthrough for Data Centers. At the Server Blade Summit, the company demonstrated dual-core Opteron servers populated with 10...
Read More »Irvine Sensors Qualifies New Stacking Process
Converts Industry-Standard TSOPs to Stacked BGA Packages COSTA MESA, Calif., April 19 / -- Irvine Sensors Corporation (Nasdaq: IRSN; Boston Stock Exchange: ISC) announced today that it has qualified a proprietary process for converting semiconductor chips originally packaged in Thin Small Outline Packages ( TSOPs ) into stacked assemblies with Ball Grid Array ( BGA )attachments. Joe Carleone,...
Read More »QUALCOMM Announces Additional Chipset Support for WorldMode Global Roaming Capabilities for CDMA2000 Subscribers
- Mainstream MSM Solutions to Feature Compatibility with CDMA2000 and Quad-Band GSM Standards with Significant BOM Savings - LAS VEGAS, CTIA Booth #2047, Hall C4/C5, April 5 /FirstCall/ -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced that additional Mobile Station Modem(TM)...
Read More »Focus Enhancements Tapes-Out Digital Chip for Talaria Ultra Wideband Technology Chipset
Campbell, Calif. - March 10, 2006 - Focus Enhancements, Inc. (NASDAQ SC: FCSE), a worldwide leader in video production and conversion technology, has taped out the second chip of its two-part Talaria(TM) Ultra Wideband (UWB) technology chipset solution. The company expects silicon of this digital/baseband/Media Access Controller (MAC) UWB chip in May. Talaria UWB chips, modules, evaluation...
Read More »NETGEAR® Teams with DS2 to Bring 200 Mbps Powerline HD Solution to Market
Innovative Powerline Technology From NETGEAR and DS2 Enables High-Quality, High-Definition Video Streaming for the Digital Home SANTA CLARA, Calif., Feb. 22 / -- NETGEAR-®, Inc. (NASDAQ:NTGR), a worldwide provider of technologically advanced, branded networking products, and Design of Systems on Silicon (DS2), a leading supplier for Powerline communications chipsets, today announced that they...
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TPA Motion Introduces Industry's First Compact Robotic Positioner for Medical Devices
TPA Motion's microplate handling robots are designed specifically for medical instruments and lab automation devices. Check out the video to learn more.
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