Wireless UARTs eliminate serial/parallel interface cables.
Supplied in 48-pin QFN packages, XR18W750 wireless UART (Universal Asynchronous Receiver Transmitter) controller and XR18W753 RF (868-956 MHz) transceiver can be used as chipset or separately. Wireless UART chipset, capable of transmitting and receiving data in point-to-point and point-to-multi-point environments, can be designed onto existing boards or integrated into add-on wireless adapter...
Read More »ADSL2+ Chipset integrates fast Ethernet transceiver.
Suited for emerging broadband markets, TC3162LEH ADSL2+ processor and TC3086 CMOS Analog Front End (AFE) help reduce system complexity and external components. Supplied in LQFP-128 package, TC3162LEH integrates Quad-IO SPI flash as well as 10/100Base-TX Fast Ethernet MAC and Transceiver with auto-negotiation function. Within its QFN-64 package, TC3086 integrates line driver that provides TR-100...
Read More »Kontron Announces Product Support for New Vesa Standard for Display Description Data
DisplayID(TM) solves the problem of inhomogeneous display data structures for embedded displays Eching, Germany, February 26, 2008 - VESA DisplayID Task Group member, Kontron, announces product support for the recently approved DisplayID specification, a new VESA standard that defines display data structures. Former specifications did not provide complete descriptions for embedded display...
Read More »Radiospire Standardizes on Synopsys VCS and VMM Methodology for Next- Generation AirHook Chipset Designs
VCS Provides Higher Productivity by Delivering 40 Percent Faster Performance MOUNTAIN VIEW, Calif., Feb. 14 -- Synopsys, Inc. (NASDAQ:SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced that Radiospire Networks, Inc. has standardized on Synopsys' VCS-® functional verification solution for SystemVerilog-based verification of their next-generation...
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Selecting the Right Materials for Your Metal Stamping Project
Learn about metals and their characteristics to help you choose the right option for your unique application.
Read More »Big Picture Experience from Mobile Devices is One Step Closer to Reality
Texas Instruments DLP-® announces production availability of new imaging chipsets for pico-projection in 2008 BARCELONA, Spain, Feb. 11 -- DLP-® Technology from Texas Instruments (TI) (NYSE:TXN), announced today production availability of a DLP Pico(TM) chipset, which includes an imaging chip and a processor to enable a new class of handheld and mobile projection products. These ground breaking...
Read More »Samsung Electro-Mechanics and Nanoradio Launch Wi-Fi Modules for Mobile Phones
BARCELONA, Spain, February 12 -- Nanoradio today announced that Samsung Electro-Mechanics, one of the world's leading electronic components manufacturers, team up in a partnership in order to provide state of the art WLAN modules to the wireless mobile industry. The two companies are already in a sampling phase for an integrated low power Wi-Fi System in Package (SiP) solution for the mobile...
Read More »HP and Qualcomm to Deliver Options for Worldwide Internet Access
BARCELONA, Spain, Feb. 11 - HP and Qualcomm today announced that they are working together to incorporate Qualcomm's Gobi(TM) global mobile Internet technology in select 2008 HP business notebooks to enable high-speed connectivity on 3G UMTS HSPA/EV-DO networks with a single wireless solution. Gobi technology enhances HP notebook customers' choice of mobile operators and will help increase...
Read More »Motorola Unveils WiMAX Devices Ecosystem Initiative
Motorola to license its WiMAX chipset-based radio reference design and essential WiMAX IP to enable a broad ecosystem of devices for consumers Announces first radio reference design licensing agreement with Enfora, a leading wireless networking solution provider BARCELONA, Spain, Feb. 11 -- Mobile World Congress 2008 -- A global leader in wireless broadband solutions, Motorola Inc. (NYSE:MOT)...
Read More »Spreadtrum Ships Thirty Millionth CEVA-Powered Baseband Chipset
CEVA's DSPs power Spreadtrum's SC6600, SC6800 and SC8800 families of wireless chipsets BARCELONA, Spain, Feb. 11 / / -- Mobile World Congress 2008 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications and Spreadtrum Communications, Inc. (NASDAQ:SPRD), one of...
Read More »Qualcomm Announces Multiple HSPA+ Trials to Take Place in 2008
Evolution of UMTS Technology Gains Momentum as Multiple Network Operators Commit to Trials SAN DIEGO, Feb. 7 - Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that multiple network operators have committed to trialing HSPA+ technology this year. To be conducted with operators including Hutchison 3G,...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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