Rudolph Technologies, Inc.
550 Clark Drive
Budd Lake, NJ 07828
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Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions
F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes Flanders, New Jersey- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that the leading MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30™ Inspection System...
Read More »Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions
F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes Flanders, New JerseyÃ- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that the leading MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30™ Inspection...
Read More »Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity...
Read More »Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStepî Advanced Packaging Lithography System and multiple NSXî Inspection Systems for use in their...
Read More »Rudolph Receives Multiple System Orders for Inspection, Metrology and Analytics of High-end Frequency Filters
Tools will be used to accelerate ramp and improve yields for SAW/BAW filters, a critical enabling technology for smartphones Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received multiple orders from a leading radio frequency (RF) filter manufacturer that includes five inspection and metrology tools in addition to process control software...
Read More »Rudolph Receives Multiple System Orders for Inspection, Metrology and Analytics of High-end Frequency Filters
Tools will be used to accelerate ramp and improve yields for SAW/BAW filters, a critical enabling technology for smartphones Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received multiple orders from a leading radio frequency (RF) filter manufacturer that includes five inspection and metrology tools in addition to process control software...
Read More »Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications
NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities Flanders, New Jersey- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17 million for several NSX®...
Read More »Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications
NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities Flanders, New JerseyÃ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17 million for several...
Read More »Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications
Tool to be used for development of copper pillar bumping and TSV processes Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through...
Read More »Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications
Tool to be used for development of copper pillar bumping and TSV processes Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStepî Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and...
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