Rudolph Technologies, Inc.
PO Box 860
Budd Lake, NJ 07828
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Inspection System offers application-specific configurations.
With Metrology suite, NSX® 320 Automated Macro Defect Inspection System offers wafer level packaging configuration, whichÂ- measures film thickness, thin remaining silicon thickness, surface topography, copper pillar height, and solder bump height. Advanced wafer level packaging configuration (2.5D) adds measurement of wafer profile, total stack thickness, and thick/thin RST, while...
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Panel Lithography System supports advanced packaging.
Capable of processing both glass and organic laminate panels in semiconductor advanced packaging market, JetStep™ features on-the-fly autofocus for thick photoresists, onboard reticle library,Â- and 6 second reticle change out wheel. System can utilize company's suite of software products, including ProcessWORKS® for run-to-run control, Discover® for yield management, and...
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Thin Film Metrology System targets 28 nm node and below.
Available for transparent films in advanced semiconductor fabrication applications, S3000SX™ System uses focused beam ellipsometry and small site measurement optics to measure thickness of single- and multi-layer films on product wafers, including device area at site sizes as small as 30 x 30 Â-µm. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow...
Read More »Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED...
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Rudolph's NSX Macro Defect Inspection System Selected by Merit Sensor Systems
The automated inspection system will assure quality of pressure sensors used in critical applications. Flanders, New Jersey -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor and related industries,announced today that it has sold an NSX®Series macro defect inspection system to Merit Sensor Systems, Inc.,...
Read More »Rudolph's Discover Yield Management Software Gains Traction in Advanced Packaging Applications
Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its Discover® Yield Management Software to a major...
Read More »Complete Lithography System meets advanced packaging needs.
Accommodating needs of semiconductor advanced packaging market, JetStep™ total lithography systemÂ- delivers full, closed-loop control. Components include JetStep 2X reduction stepper integrated with Rudolph equipment automation and fault detection software; NSX® inspection tool for CD overlay measurements; ProcessWORKS® APC run-to-run control system software; ARTIST®...
Read More »Rudolph's Yield Management System Chosen for Manufacture of High Definition Displays in Mobile Devices
Genesis® Enterprise offline yield analysis and data management will be used to maximize factory efficiency and identify causes of yield loss Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for the semiconductor, FPD, LED and solar industries, announced today the sale of its Genesis Enterprise yield...
Read More »Rudolph's MetaPULSE System Selected for Advanced Packaging R&D
Dynamic growth in advanced packaging arena drives need for critical process characterization technologies Flanders, New Jersey - Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of inspection, metrology and process control software for semiconductor manufacturing, announced today that a premier global industry research center in Asia has purchased Rudolph's MetaPULSE® G...
Read More »Thin Film Metrology System meets needs of mobile display market.
Combining MetaPULSE measurement head with customized glass substrate handling, MetaPULSE® FP uses Picosecond Ultrasonic Laser Sonar (PULSE(TM)) Technology to measure critical thickness of metal layers deposited during manufacturing process. This lends to precise process control while providing non-contact, non-destructive, on-product measurements of single- and multi-layered opaque thin...
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