Rudolph Technologies, Inc.

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Printing & Duplicating Equipment

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph

Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New JerseyÂ- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph...

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Sensors, Monitors & Transducers

Macro Defect Inspection Tool targets advanced packaging/metrology.

Able to produceÂ- complete wafer characterization within packaging process, NSX® 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability....

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Food Processing & Preparation

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These...

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Food Processing & Preparation

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software...

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Printing & Duplicating Equipment

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New JerseyÂ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep® W2300 Advanced Packaging Lithography System for the development of...

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Test & Measurement

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes Flanders, New JerseyÂ-  - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that the leading MEMS company, Robert Bosch GmbH, has selected Rudolph to supply several different configurations of its F30™ Inspection...

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Printing & Duplicating Equipment

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their...

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Electronic Components & Devices

Rudolph Receives Multiple System Orders for Inspection, Metrology and Analytics of High-end Frequency Filters

Tools will be used to accelerate ramp and improve yields for SAW/BAW filters, a critical enabling technology for smartphones Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received multiple orders from a leading radio frequency (RF) filter manufacturer that includes five inspection and metrology tools in addition to process control software...

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Test & Measurement

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities Flanders, New JerseyÂ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17 million for several...

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Printing & Duplicating Equipment

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and...

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