Rudolph Technologies, Inc.
550 Clark Drive
Budd Lake, NJ 07828
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Inspection Systems support semiconductor manufacturing.
Configurable for wafer or panel substrates, Firefly™ Inspection and Metrology System provides high-resolution inspection in front- and back-end applications. It can detect defects smaller than 1 micron in fan-out wafer level packaging, CMOS image sensors, MEMS and RF sensors. With 2D inspection sensitivity down to 2 microns, Dragonfly™ System targets large die, multi-chip advanced packaging...
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Inspection Systems support semiconductor manufacturing.
Configurable for wafer or panel substrates, Firefly™ Inspection and Metrology System provides high-resolution inspection in front- and back-end applications. It can detect defects smaller than 1 micron in fan-out wafer level packaging, CMOS image sensors, MEMS and RF sensors. With 2D inspection sensitivity down to 2 microns, Dragonfly™ System targets large die, multi-chip advanced packaging...
Read More »Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection
Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...
Read More »Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection
Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...
Read More »Inspection System includes high-speed 3D metrology.
With high-speed 3D metrology, NSX-® Series is capable of high-volume production monitoring as well as process development and control of die-level interconnects. Data is collected in seconds from millions of bumps and then analyzed by Discover Software analysis database. Engineers gain insight into critical metrology applications, from both individual bump point of view or holistically as wafer,...
Read More »Inspection System includes high-speed 3D metrology.
With high-speed 3D metrology, NSXÃ-® Series is capable of high-volume production monitoring as well as process development and control of die-level interconnects. Data is collected in seconds from millions of bumps and then analyzed by Discover Software analysis database. Engineers gain insight into critical metrology applications, from both individual bump point of view or holistically as...
Read More »
Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing line....
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Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStepî Lithography System for the semiconductor advanced packaging industry’s first panel...
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Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection
NSX 330 Inspection Systems selected for large-scale ramp of package production Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading foundry in Asia has placed an order for over $15 million USD for multiple NSX-® 330 Systems. The systems will be used for inspection of next-generation fan-out wafer level packaging products, including whole-wafer...
Read More »
Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection
NSX 330 Inspection Systems selected for large-scale ramp of package production Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading foundry in Asia has placed an order for over $15 million USD for multiple NSXÃ-® 330 Systems. The systems will be used for inspection of next-generation fan-out wafer level packaging products, including whole-wafer...
Read More »