Press Release Summary:
Inspection tool-set, comprised of NSX(TM) and B20(TM) Systems, features backside color processing capability and auto-die classification. NSX Systems offer frontside inspection, B20 Systems offer backside inspection, and Harmony ASR(TM) (all-surface review) Software offers defect analysis and management. Combined with brightfield and darkfield capabilities, B20 Systems use color processing capability to increase sensitivity to subtle color defects such as chemical stains and micro arcings.
Original Press Release:
Rudolph Systems Detect New Class of Wafer Backside Defects and Correlate to Frontside Die
European fab prefers new B20 system color processing with Harmony ASR auto-die classification; places multi-unit order
San Francisco, CA (July 11, 2006)-Building on its leadership position in all-surface macro defect inspection, Rudolph Technologies, Inc. (NASDAQ: RTEC), today announced a multi-system order for its NSX(TM) and B20(TM) Systems to a major European semiconductor fab. The inspection tool-set, featuring new backside color processing capability and auto-die classification, will be used for outgoing quality assurance in back-end semiconductor manufacturing-the critical last opportunity to catch defects before the semiconductor ICs are diced and packaged. The configuration includes NSX Systems for frontside inspection, B20 Systems for backside inspection, and Harmony ASR(TM) (all-surface review) Software for defect analysis and management.
According to Mayson Brooks, vice president of global inspection sales for Rudolph Technologies, "Color processing capability on the B20 System allows our customer to detect a new class of subtle backside defects and correlate them to frontside die-both of which were key factors in the their purchase decision."
The NSX Series, when combined with the B20 Backside Inspection module, can detect defects on the backside and include them with the frontside inspection results. The B20 System has both brightfield and darkfield capabilities to detect a wide range of defects.
The innovative color processing capability increases the sensitivity of the system to subtle color defects, such as chemical stains and micro arcings, which are invisible to conventional light-scattering inspection system or review scopes. In addition to detecting defects, the B20 System can capture the coordinates and images of these defects and pass them on to the Harmony ASR Software. Rudolph's Harmony ASR allows the user to review frontside and backside images together, determine the severity of the defect, and "knock out" individual die based on defects on the front or back of that die. Unaffected die are retained, resulting in a significant improvement in process yield. This all-surface correlation allows a customer to scrap only problem die, rather than entire wafers.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.