Rudolph Technologies, Inc.
550 Clark Drive
Budd Lake, NJ 07828
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Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New Jersey- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph...
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Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New JerseyÃ- - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStepî W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph...
Read More »Macro Defect Inspection Tool targets advanced packaging/metrology.
Able to produce- complete wafer characterization within packaging process, NSX® 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability....
Read More »Macro Defect Inspection Tool targets advanced packaging/metrology.
Able to produceÃ- complete wafer characterization within packaging process, NSXî 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability....
Read More »Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey- – Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive...
Read More »Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyÃ- – Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive...
Read More »Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software...
Read More »Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software...
Read More »Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep® W2300 Advanced Packaging Lithography System for the development of next-generation...
Read More »Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New JerseyÃ- — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStepî W2300 Advanced Packaging Lithography System for the development of...
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