Rudolph Technologies, Inc.

Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
Printing & Duplicating Equipment

Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

Overall market growth drives semiconductor processing ramp and increased demand for Rudolph’s JetStep Advanced Packaging Lithography System. Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new customer will use the...

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Test & Measurement

Rudolph Gains Traction in Mobile Device Market with Multi-System Orders for Its MetaPULSE G Metrology System

MetaPULSE G system has been widely adopted for critical process control of advanced components in smartphones and mobile devices Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received multi-system orders from several customers for its latest MetaPULSE® G metal metrology system in support of their mobile device components ramp. The MetaPULSE...

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Software

Rudolph Wins Yield Management Software Sale from the College of Nanoscale Science and Engineering

Leading research enterprise recognizes the value of the analytics that Rudolph’s Yield Management Software will bring to its Global 450 Consortium program Flanders, New Jersey –Â- Rudolph Technologies, Inc. (NYSE: RTEC) announced today that the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise™ Yield Management Software (YMS) to...

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Software

Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Large order for multiple NSX inspection tools includes Wafer Scanner system and Discover yield management software to provide a comprehensive 2D/3D solution for advanced packaging processes Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services...

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Software

Rudolph Announces Record Installations of Its Advanced Process Control Software

Following a record number of Yield Management Software installations, Rudolph experiences increased demand for its Advanced Process Control Software as it becomes critical to customers in maintaining yield during high-volume manufacturing Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has completed a record number of installations for its ARTIST®...

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Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process Development
Test & Measurement

Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process Development

First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec...

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Rudolph Technologies Wins Multiple Lithography Orders
Printing & Duplicating Equipment

Rudolph Technologies Wins Multiple Lithography Orders

Systems sold into advanced packaging and flat panel display markets Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep™ Lithography System for advanced packaging (AP) applications and a repeat order for a...

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Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
Test & Measurement

Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost Flanders, New JerseyÂ- — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory...

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Software

Rudolph Technologies' Management System Earns ISO 9001:2008 Certification

Registration reflects commitment to continuous process improvement and pursuit of customer satisfaction Flanders, New Jersey — Rudolph Technologies, Inc. (NASDAQ: RTEC) announced today that it has earned certification to ISO 9001:2008 for its quality management system and shared services corporate departments at three of its major business unit locations. The rigorous certification process...

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Defect Inspection System handles wafers up to 300 mm.
Sensors, Monitors & Transducers

Defect Inspection System handles wafers up to 300 mm.

Designed for semiconductor, MEMS, and LED facilities, NSX® 220 Automated Macro Defect Inspection System uses gray-scale image analysis with color image capture for inspection and metrology in final manufacturing applications. It can detect scratches, mechanical damage, foreign materials, voids, and probe damage, while also performing 2D measurements on bumps, probe marks, and edge trim...

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