Rudolph Technologies, Inc.

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

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New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

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Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

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Latest NovusEdge Inspection System Uses Multiple Cameras
Test & Measurement

Latest NovusEdge Inspection System Uses Multiple Cameras

The NovusEdge™ System is designed for edge, notch and backside inspection of unpatterned wafers. The system is offered with multiple cameras, advanced technologies for delivering composite image of the entire wafer bevel. The device uses sophisticated analytical routines for identifying and classifying defects as small as the sub-micron level. It utilizes high-speed laser-scanning to detect...

Read More »
New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology
Test & Measurement

New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology

The Dragonfly™ G2 Inspection and Metrology System is offered with multiple sensor options and benefits of the Firefly™ system. This system enables packaging customers to meet the wafer-based application challenges. The unit is embedded with proprietary camera technology and supports Truebump™ Technology for non-visual residue detection. It comes with streamlined software algorithms for...

Read More »
Inspection Systems support semiconductor manufacturing.
Test & Measurement

Inspection Systems support semiconductor manufacturing.

Configurable for wafer or panel substrates, Firefly™ Inspection and Metrology System provides high-resolution inspection in front- and back-end applications. It can detect defects smaller than 1 micron in fan-out wafer level packaging, CMOS image sensors, MEMS and RF sensors. With 2D inspection sensitivity down to 2 microns, Dragonfly™ System targets large die, multi-chip advanced packaging...

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Controls & Controllers

Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...

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Test & Measurement

Inspection System includes high-speed 3D metrology.

With high-speed 3D metrology, NSX® Series is capable of high-volume production monitoring as well as process development and control of die-level interconnects. Data is collected in seconds from millions of bumps and then analyzed by Discover Software analysis database. Engineers gain insight into critical metrology applications, from both individual bump point of view or holistically as...

Read More »
Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Printing & Duplicating Equipment

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel...

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Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection
Test & Measurement

Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection

NSX 330 Inspection Systems selected for large-scale ramp of package production Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading foundry in Asia has placed an order for over $15 million USD for multiple NSX® 330 Systems. The systems will be used for inspection of next-generation fan-out wafer level packaging products, including whole-wafer...

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Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Printing & Duplicating Equipment

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s...

Read More »
New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats
Printing & Duplicating Equipment

New JetStep Lithography Systems are Suitable for Advanced Packaging Processes on Wafer and Panel Formats

Creates redistribution layers (RDLs), silicon interposers, through silicon vias (TSVs), copper pillars and micro-bumps on reconstituted wafers. Offered with submicron lens for ultra-fine SiP interconnects and large-scale 50 mm package sizes. Features on-the-fly optical focusing, inter-field magnification compensation, and new edge focus and alignment capabilities.

Read More »
Company News

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Process control systems used for advanced packaging of DRAM products in Korea and China facilities; additional orders expected to meet capacity ramp Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be...

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Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Test & Measurement

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in...

Read More »
Company News

Rudolph's Novusedge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Backlog for recently released system increases to over $12M Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional...

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Latest NovusEdge Inspection System Uses Multiple Cameras
Test & Measurement

Latest NovusEdge Inspection System Uses Multiple Cameras

The NovusEdge™ System is designed for edge, notch and backside inspection of unpatterned wafers. The system is offered with multiple cameras, advanced technologies for delivering composite image of the entire wafer bevel. The device uses sophisticated analytical routines for identifying and classifying defects as small as the sub-micron level. It utilizes high-speed laser-scanning to detect...

Read More »
New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology
Test & Measurement

New Dragonfly Inspection and Metrology System from Rudolph Comes with Clearfind Technology

The Dragonfly™ G2 Inspection and Metrology System is offered with multiple sensor options and benefits of the Firefly™ system. This system enables packaging customers to meet the wafer-based application challenges. The unit is embedded with proprietary camera technology and supports Truebump™ Technology for non-visual residue detection. It comes with streamlined software algorithms for...

Read More »
Inspection Systems support semiconductor manufacturing.
Test & Measurement

Inspection Systems support semiconductor manufacturing.

Configurable for wafer or panel substrates, Firefly™ Inspection and Metrology System provides high-resolution inspection in front- and back-end applications. It can detect defects smaller than 1 micron in fan-out wafer level packaging, CMOS image sensors, MEMS and RF sensors. With 2D inspection sensitivity down to 2 microns, Dragonfly™ System targets large die, multi-chip advanced packaging...

Read More »
Controls & Controllers

Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...

Read More »
Test & Measurement

Inspection System includes high-speed 3D metrology.

With high-speed 3D metrology, NSX® Series is capable of high-volume production monitoring as well as process development and control of die-level interconnects. Data is collected in seconds from millions of bumps and then analyzed by Discover Software analysis database. Engineers gain insight into critical metrology applications, from both individual bump point of view or holistically as...

Read More »

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