Tra-Con, Inc.
Bedford, MA 01730
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Fiber Optic Epoxy offers color change feature.
TRA-BOND F253M two-part, low viscosity epoxy minimizes fiber pistoning and moisture absorption while maintaining long pot life and high temperature performance. Unmixed components are yellow and turn greenish blue upon mixing. With full cure, epoxy turns deep reddish-amber. Material develops strong bonds to fiber optic and optical materials that include most metals, ceramics, glass, and plastics.
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Epoxy Adhesive cures in as little as 3 minutes.
TRA-BOND 224-1 cures in 4 hrs at room temperature or 3 minutes at 95Ã-
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Epoxy Adhesive suits high-temperature applications.
TRA-BOND 2248 high-temperature epoxy staking adhesive bonds to metals, glass, ceramics, and plastics in applications up to 190Ã-
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Flexible Adhesive suits high-speed component attachment.
Tra-Duct 926K01 consists of silver, 2-part epoxy adhesive that develops electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Able to be heat cured in one hour at 100Ã-
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Epoxy works with difficult-to-bond metals.
TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75Ã-
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Polyurethane Adhesive suits aerospace/military applications.
NASA outgassing approved Tra-Bond 240-2 offers various cure schedules, including one at room temperature. Flexible polyurethane is suited for aerospace and military applications where substrates consist of polyurethane or other hard-to-bond-to materials. With work life of 2 hr at room temperature, product has a shelf life of 6 months when stored at -40Ã-
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Epoxy encapsulates microelectronic chips.
TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.
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Flexible Epoxy bonds to variety of surfaces.
TRA-BOND 872-3 transparent, flexible epoxy bonds materials with mismatched coefficients of thermal expansion. It readily bonds to metals, plastics, glass, and ceramics. When fully cured, epoxy is a translucent, electrically insulating material, with added resistance to moisture, gases, petroleum products and many other chemicals. Long work-life makes it suitable for applications involving...
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Epoxy Compound cures at room temperature.
General-purpose casting compound LX30007, suited for underfill and encapsulating applications, produces strong bonds, with lap shears of over 2,000 psi. With glass transition temperature of 78Ã-
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Potting Compound cures at room temperature.
Type LX20111 2-part epoxy develops strong bonds to variety of substrates and can achieve lap shears of 2,900 psi. When cured, substance resists many organic and inorganic compounds and is thermally and electrically insulating. LX20111 reaches glass transition temperature of 64Ã-
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