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(Showing headlines 341 - 360)   << 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 ...

PC Connectors promote compact electronic designs.

Phoenix Contact    Harrisburg, PA 17111 0100
Jan 18, 2012 Compact versions of PC 5 connectors enable installers to wire currents up to 41 A UL and conductors up to 8 AWG in space-restricted areas, fostering compact equipment design. All connectors are plug-compatible to existing PC 5 and PC 4 headers and panel-mount plug connectors. Compact versions are offered with or without screw flange or with tool-free, click-and-lock latching system in 2-12 positions.

Miniature 01005-Size MLCC improves power amplifier efficiency.

Miniature 01005-Size MLCC improves power amplifier efficiency.

Murata Power Solutions, Inc.    Mansfield, MA 02048
Jan 17, 2012 Supplied in W4PI tape packaging style, GJM02 series monolithic ceramic chip capacitors (MLCC) are designed for use in high-frequency module applications such as for coupling in power amplifiers of cellular phone handsets. This 01005 size (EIA) Hi Q type MLCC measures 0.4 x 0.2 mm and has both high Q and low equivalent serial resistance (ESR) characteristics, making series suited for use in VHF, UHF, and microwave power amplifiers.

Thermocouple Port has high-density design.

Thermocouple Port has high-density design.

Abbess Instruments & Systems, Inc.    Ashland, MA 01721
Jan 17, 2012 Providing for up to 80 thermocouple pairs - 16 x 5-pair subassemblies - over 10 in. dia footprint, High Density, High Count, Thermocouple Port for 1x10-10 Torr is suited for Altitude Test and Space Simulation users. Single-sensor fault is resolved by changing out one affected feedthrough subassembly, and blanked (leak tested) feedthrough subassembly positions A/R for future upgrade/refurbishing flexibility. Also standard, chamber port accepts Thermocouple Feedthrough Assembly.

Power MOSFETs meet military, aerospace market demands.

Semicoa    Costa Mesa, CA 92626
Jan 17, 2012 Covering range of JAN, JANTX, JANTXV, and JANS level applications, power MOSFETs leverage proprietary architecture from N- and P-Channel topologies to address performance and supply constraints specific to defense/aerospace applications. Radiation hardened MOSFETs offer ranges from 30-500 V, meeting and exceeding 100K rad levels, and non-radiation hardened versions are also available within same voltage ranges. Both versions meet Defense Logistics Agency (DLA) slash sheet specifications.

Piezoelectric Sounders operate at 2.4 kHz.

Murata Electronics North America, Inc.    Smyrna, GA 30080
Jan 16, 2012 Featuring thin 3 mm profile and sound pressure level of 75 dB, PKLCS Series fits in miniaturized electronics. Series includes Model PKLCS1212E2400-R1 for portable consumer devices and Model PKLCS1212E24A1-R1 for automotive and industrial applications. Housed in surface mount package, devices can be mounted via pick and place equipment and survive reflow soldering with no impact on performance.

Single, Dual LNBRs enhance satellite receiver operation.

Allegro MicroSystems Inc.    Worcester, MA 01615
Jan 16, 2012 Low noise block converter regulator (LNBR) models A8295, A8297, and A8298 provide power and interface signals to LNB down converter via coaxial cable. Integrated boost MOSFET, current sensing, and compensation simplify design as well as minimizes components and PCB size. While single-output A8295 serves single-tuner satellite STB market, dual-output A8297 is suited for dual-tuner DVR models, and ceramic capacitor-capable A8298 targets SFF satellite tuner applications.

Class-D Audio Amplifier  delivers 3.2 W/mm² power density.

Class-D Audio Amplifier delivers 3.2 W/mm² power density.

STMicroelectronics    Lexington, MA 02421
Jan 13, 2012 Measuring 100 mm², Model TDA7498E delivers 320 W of total output power, 160 W on each channel. Device exhibits SNR of 100 dB and provides 4 selectable, fixed-gain settings at 23.8, 29.8, 33.3, and 35.8 dB. Analog IC enables design of platform solutions where speaker impedance can be changed from 8-2 W without power or current limitation. Other features include built-in suppression of pop/click noises, standby and mute functions, and balanced input for best TDMA noise rejection.

Baseband Processor enables next generation smartphones.

Broadcom Corp.    San Jose, CA 95110
Jan 13, 2012 Integrating 1 GHz ARM11 processing core, Model BCM21552G supports 3GPP release 6/7 features, which provide 5.8 Mbps upstream connectivity, 7.2 Mbps downstream connectivity, and support for next generation CS over HSPA services. Built-in graphics core supports D1/VGA quality video and ability to encode/decode H.264 video at 30 fps. Based on BCM21552G, reference design includes multi-band 2G/3G RF transceiver and InConcert® connectivity suite, enabling Wi-Fi Direct, Bluetooth, navigation, and NFC.

Single-Chip Solution drives HomePlug PLC product development.

Qualcomm Atheros Inc.    San Jose, CA 95110
Jan 13, 2012 Intended for next-generation HomePlug® powerline communications (PLC) devices, QCA6410 integrates memory, 10/100 Ethernet PHY, analog front end/line driver, and power management unit in single chip. It supports IEEE 1901/HomePlug AV powerline networking protocol and delivers 200 Mbps networking performance, enabling PLC products such as standalone adapters and extenders as well as embedded PLC in TVs and IP STBs. Product draws less than 1.8 W.

Panel-Mount Connectors feature dip solder contacts.

Panel-Mount Connectors feature dip solder contacts.

Binder-USA, LP    Camarillo, CA 93012
Jan 12, 2012 Series 820 and 870 include 7/8 in. panel-mount connectors with dip solder contacts. With dip solder contacts, connectors can be mounted to PCB board. Suited for power supplies, Fieldbus, and Ethernet applications, receptacles are available in male and female versions with 2+PE, 4, and 4+PE gold-plated contacts. Front- and rear-mountable positions allow receptacles to be mounted from back or front of panel. All versions have UL approval and IP67 rating.

Ceiling Enclosure provides 50 lb capacity for projector.

Ceiling Enclosure provides 50 lb capacity for projector.

FSR Metal Products    West Paterson, NJ 07424
Jan 12, 2012 Suitable for conference centers, schools, and meeting facilities, Model CB-224 has pull-down 4 RU cage with gas spring-assisted ball bearing slide and 2 RU of angle-adjustable rack mounting surfaces on either end of cage for patch panels. Each side of box has edge-protected bundled cable inlet cavity, filled with flame retardant foam seal. Available with or without pole-mount and smart electronics, box comes equipped with 5 internal outlets, 1 external outlet, and fan.

Light Emitting Diode features 2.5 x 2.5 mm footprint.

Light Emitting Diode features 2.5 x 2.5 mm footprint.

Cree, Inc.    Durham, NC 27703
Jan 12, 2012 Leveraging silicon carbide technology, XLamp® XB-D LED delivers up to 139 lumens and 136 lumens/W in cool white, or up to 107 lumens and 105 lumens/W in warm white, both at 350 mA and 85°C. Device features 1 A maximum drive current, low thermal resistance of 6.5°C/W, and wide viewing angle of 115°. LED is suited for lighting applications where high lumen density and compact light sources are required.

MultiMode TD-LTE Baseband Modem supports Chinese standards.

Spreadtrum Communications Corp.    Sunnyvale, CA 94085
Jan 12, 2012 Designed with 40 nm CMOS silicon, SC9610 integrates multiple communication standards - multiband TD-LTE and TD-SCDMA as well as quad-band EDGE/GPRS/GSM - into single-chip design. Solution is specifically designed for communication standards in use in China, supports multiple bands, and achieves respective downlink and uplink speeds of 100 and 50 Mbps. Furthermore, product supports 5, 10, 15, and 20 MHz channels and 2x2 MIMO.

High-Performance ASIC enhances tablet touchscreen performance.

Synaptics    Santa Clara, CA 95054
Jan 12, 2012 Supporting up to 12 in. touchscreens with tracking of 10 or more fingers, ClearPad(TM) 7300 is designed for tablet market, including Google Android and MS Windows 8 devices. Singular ASIC architecture enables size and weight minimizations in tablet design by reducing internal space and power requirements. Touch controller silicon and SignalClarity(TM) Technology promote tracking accuracy and finger separation as well as environmental and electrical noise immunity.

RF Transceiver addresses MoCA 2.0 specification.

ViXS Systems Inc.    Toronto M2J 1R3  Canada
Jan 12, 2012 Optimized to work with XCode® Multi Stream HD Transcoding SoC network media processors, XConnex 1000 integrates power amplifier, low noise amplifier, and transmit/receive switch. Device supports 425-1,650 MHz frequency range, MoCA Band A-D, Band E, and Band F frequencies and specifications for transmission over existing coax infrastructure. Transceiver co-exists with video and broadband services of Telco, cable, and satellite service providers.

RF Front-End Module supports 4G product development.

Microsemi    Irvine, CA 92614
Jan 12, 2012 Within 5 x 5.6 mm monolithic SiGe die, RF Front-End Module integrates two 2.5 GHz IEEE 802.16 power amplifiers, 2 transmit/receive switches, 2 LNAs, 2 baluns, harmonic and noise shaping filters, and digital interface for control and tuning. Device supports multiple input/output functionality, and meets strict 802.16 mask and EVM requirements at output power of 24 dBm.

Guitar Potentiometers help optimize sound quality.

Bourns, Inc.    Riverside, CA 92507 2129
Jan 12, 2012 Available for electric and bass guitars, PDB Series includes no load, left handed, and long bushing potentiometers. No load model features long-wearing insulator and positive action detent, while left-handed models have reverse audio tapers and logarithmic curve specifically designed for optimal volume response at all positions. Intended for solid body guitars, long bushing models operate with or without push-pull switch.

Planar Transformers feature 600 W/in. power density.

MPS Industries    Gardena, CA 90248
Jan 12, 2012 Intended for applications that have space, weight, and/or height restrictions, Planar Transformers combine low-profile planar magnetics, advanced winding geometry, and interleaving technology. Offering optimized heat dissipation and minimal leakage inductance, devices are suited for variety of uses in automotive, medical, military, aerospace, and telecom industries, including high switching frequency power supplies and high-current DC/DC converters.

Native PCIe SSD Controller  offers modular scalability.

Native PCIe SSD Controller offers modular scalability.

Marvell Semiconductor Inc.    Santa Clara, CA 95054
Jan 11, 2012 Providing core building block for incrementally scalable native PCIe SSDs, Model 88NV9145 supports PCIe 2.0 x1 interface, ARM-based processor, external DDR interface, and 4 NAND flash channels with up to 4 Chip Selects per channel. In addition, each 88NV9145 can support up to 128 GB NAND capacity and has been tested to achieve up to 93,000 4K random read IOPS and 70,000 4K random write IOPS.

VDSL2 Vectoring Chip eliminates crosstalk noise.

Lantiq    Neubiberg   Germany
Jan 11, 2012 Suitable for delivery of triple-play broadband services, VINAX(TM) IVE1000 System-Level Vectoring Engine Chip supports up to 384 VDSL2 ports. Unit uses advanced signal processing techniques to cancel far-end crosstalk between any VDSL2 lines in copper bundle. By eliminating crosstalk, service providers can achieve 100 Mbps symmetrical and beyond. Chip is compliant with and capable of supporting all features defined in ITU G.993.2, G.993.5, and ITU G.997.




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