Nortel Compatible SFP Transceiver Module
Toronto, Canada - GAO Fiber Optics (www.GAOFiberOptics.com), a leading supplier of optical transceivers, recommends its Nortel compatible transceiver with a small form factor design. This transceiver is intended for 10 Gigabit per second SONET/SDH, Fiber Channel, gigabit Ethernet, 10 gigabit Ethernet and other applications such as DWDM links or MMF applications. It is a hot-swappable,...
Read More »Nortel Compatible SFP Transceiver Module
Toronto, Canada - GAO Fiber Optics (www.GAOFiberOptics.com), a leading supplier of optical transceivers, recommends its Nortel compatible transceiver with a small form factor design. This transceiver is intended for 10 Gigabit per second SONET/SDH, Fiber Channel, gigabit Ethernet, 10 gigabit Ethernet and other applications such as DWDM links or MMF applications. It is a hot-swappable,...
Read More »Video Transceiver supports 2-way transmission over single fiber.
Available in stand-alone or rack-mount card versions, hot-pluggable GFS110 fiber optic digital video transceiver module supports transmission of 2-way video over one optical fiber. It fully supports NTSC, PAL, and SECAM video formats and uses 10-bit/20 MHz sampling technology for video digital encoding. Optical, all digital, high-speed, and synchronous transmission channel features ensure video...
Read More »Video Transceiver supports 2-way transmission over single fiber.
Available in stand-alone or rack-mount card versions, hot-pluggable GFS110 fiber optic digital video transceiver module supports transmission of 2-way video over one optical fiber. It fully supports NTSC, PAL, and SECAM video formats and uses 10-bit/20 MHz sampling technology for video digital encoding. Optical, all digital, high-speed, and synchronous transmission channel features ensure video...
Read More »Material Selection Guide: High & Low Density Polyethylene
In this eBook, learn about high-density and low-density polyethylene's similarities, differences, and practical applications from New Process Fibre.
Read More »WAGO Bluetooth® RF-Transceiver Module Receives Control Engineering 2010 Engineers' Choice Award
GERMANTOWN, WI - February 2010 - WAGO Corporation's 750-644 Bluetooth® RF-Transceiver Module has won Control Engineering's 2010 Engineers' Choice for Wireless Products - General" category. Control Engineering readers evaluated 96 products within 29 industrial subcategories to identify new products that best represent technological advancement, service to industry and market impact. "With more...
Read More »WAGO Bluetooth-® RF-Transceiver Module Receives Control Engineering 2010 Engineers' Choice Award
GERMANTOWN, WI - February 2010 - WAGO Corporation's 750-644 Bluetooth-® RF-Transceiver Module has won Control Engineering's 2010 Engineers' Choice for Wireless Products - General" category. Control Engineering readers evaluated 96 products within 29 industrial subcategories to identify new products that best represent technological advancement, service to industry and market impact. "With more...
Read More »Quad-Radio IC includes WLAN, GPS, Bluetooth®, and RF.
WiLink(TM) 7.0 single-chip system includes WLAN 802.11n core with WiFi and Soft AP mode capabilities. Integrated GPS core has multipath resolution engine coupled with algorithms for positioning in urban canyons, and device also supports both Bluetooth low-energy and 3.0 specifications. Chip also incorporates FM transmit/receive functionality and features hardware that cancels out board- and...
Read More »Quad-Radio IC includes WLAN, GPS, Bluetooth-®, and RF.
WiLink(TM) 7.0 single-chip system includes WLAN 802.11n core with WiFi and Soft AP mode capabilities. Integrated GPS core has multipath resolution engine coupled with algorithms for positioning in urban canyons, and device also supports both Bluetooth low-energy and 3.0 specifications. Chip also incorporates FM transmit/receive functionality and features hardware that cancels out board- and...
Read More »3G HSPA Chipset enables high-speed smartphone development.
Designed in 65 nm CMOS process, 3G phone-on-a-chip and RF solution integrate all key 3G cellular and mobile technologies for powering 3G smartphone and smart feature phone segments. Baseband processor BCM21553 offers cellular connectivity and graphics capabilities for HSUPA applications, while RF transceiver provides support for all global frequency combinations covering 3G-enabled devices....
Read More »3G HSPA Chipset enables high-speed smartphone development.
Designed in 65 nm CMOS process, 3G phone-on-a-chip and RF solution integrate all key 3G cellular and mobile technologies for powering 3G smartphone and smart feature phone segments. Baseband processor BCM21553 offers cellular connectivity and graphics capabilities for HSUPA applications, while RF transceiver provides support for all global frequency combinations covering 3G-enabled devices....
Read More »Micro Air's Dust, Fume, Mist Collection Equipment Facilitate a Safe Work Environment
Dust, fume, and mist collectors from Micro Air promote a safer, more productive work environment. Our wide array of products are available to the industrial manufacturing sector for processes such as welding, cutting, grinding, blasting, and more. Check out our video to learn more.
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