Repair Compounds

Epoxy Adhesive creates electrically insulating contacts.
Repair Compounds

Epoxy Adhesive creates electrically insulating contacts.

Tra-Bond 816H02 is suitable for stacking transistors, diodes, resistors, and integrated circuits to PCBs. Rheology of adhesive allows it to stay in place once dispensed. It bonds readily to metals, silica, steatite, sapphire, ceramics, glass, and plastics. It can be cured at room temperature to Shore D Hardness of 90 and has working life of 1.5 hr.

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Epoxy Adhesive creates electrically insulating contacts.
Repair Compounds

Epoxy Adhesive creates electrically insulating contacts.

Tra-Bond 816H02 is suitable for stacking transistors, diodes, resistors, and integrated circuits to PCBs. Rheology of adhesive allows it to stay in place once dispensed. It bonds readily to metals, silica, steatite, sapphire, ceramics, glass, and plastics. It can be cured at room temperature to Shore D Hardness of 90 and has working life of 1.5 hr.

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Repair and Patching Compound is offered in caulking tubes.
Repair Compounds

Repair and Patching Compound is offered in caulking tubes.

Single-component, aluminum-loaded Lab-metal hardens by exposure to air into sandable, grindable, tappable metal. Dent filler withstands temperatures to 350-°F or one-time exposures to 425°F. Ready-to-use metal putty is also available as Hi-Temp Lab-metal, which withstands temperatures to 1000°F. Packaged in 20 oz caulking tubes, product seals seams and other specialized applications.

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Repair and Patching Compound is offered in caulking tubes.
Repair Compounds

Repair and Patching Compound is offered in caulking tubes.

Single-component, aluminum-loaded Lab-metal hardens by exposure to air into sandable, grindable, tappable metal. Dent filler withstands temperatures to 350-°F or one-time exposures to 425°F. Ready-to-use metal putty is also available as Hi-Temp Lab-metal, which withstands temperatures to 1000°F. Packaged in 20 oz caulking tubes, product seals seams and other specialized applications.

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Encapsulant/Potting Material exhibits
Repair Compounds

Encapsulant/Potting Material exhibits

Ceramacast(TM) 510 aluminum oxide based, hydraulic-setting ceramic compound potting material can be used to encapsulate cartridge heaters and embed high temperature components to 3200-ºF. Supplied as dry powder, Ceramacast 510 is bonded using calcium aluminate and as-cast. Its dried density is 180 lbs/ft3, and it exhibits exceptional thermal conductivity and dielectric strength of 75-100...

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Encapsulant/Potting Material exhibits
Repair Compounds

Encapsulant/Potting Material exhibits

Ceramacast(TM) 510 aluminum oxide based, hydraulic-setting ceramic compound potting material can be used to encapsulate cartridge heaters and embed high temperature components to 3200Â-ºF. Supplied as dry powder, Ceramacast 510 is bonded using calcium aluminate and as-cast. Its dried density is 180 lbs/ft3, and it exhibits exceptional thermal conductivity and dielectric strength of 75-100...

Read More »

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