Press Release Summary:
Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.
Original Press Release:
TRA-BOND 2151 is a thixotropic heat conductive electrically insulating compound. This two-part epoxy develops strong, durable bonds and can be room temperature or heat cured. TRA-BOND 2151 has a coefficient of thermal expansion allowing good bonds to several surfaces including metals, silica, alumina, ceramincs, glass, plastics and many other metals. This rigid compound is ideal for many uses including staking transistors, diodes, resistors, integrated circuits and other heat sensitive applications. TRA-BOND 2151 also passes NASA outgassing specifications.
TRA-CON has been a leader in the epoxy industry for over thirty years and has more than 500 products to choose from. For further information on any of our products and to request a free sample, contact our Application Engineering Department at 1-800-TRA-CON1 or visit us on the web at www.tra-con.com.