Signal Processor offers multi-channel routing between sources.
With 10 video inputs and outputs, Model FA-1010 offers multi-channel routing between sources as well as video and audio signal processing for line, relay, reporting, production, editing, and delivery applications. Unit supports 1080p, 1080i, 720p, NTSC, and PAL video formats. Delivering 16 channels of embedded audio for 3G/HD-SDI synchronous/asynchronous input and 12 channels for each synchronous...Read More »
Electron Beam Metallization System ensures uniformity.
Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...Read More »
TELES Selects TranSwitch's Atlanta 2000 Solution for 3G Cellular Broadband Gateways
TranSwitch’s Atlanta 2000 Gigabit Communications Processors Enable TELES to Deliver High Quality VoIP Solutions for Retail and Business Applications SHELTON, CT– TranSwitch Corporation (NASDAQ: TXCC), a leading provider of semiconductor solutions in the rapidly growing consumer electronics and telecommunications markets, today announced a design win with TELES for a new 3G Cellular Broadband...Read More »
Xilinx and Its Ecosystem Showcase All Programmable and Smarter Vision Systems at NAB 2013
10 demonstrations highlight smart real-time analytics, intelligent transport, and immersive displays for next-generation broadcast systems LAS VEGAS - NAB 2013, booth #N311 - Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem are demonstrating All Programmable and smarter professional broadcast systems, which employ Xilinx-® solutions for video and Smarter Vision applications.- Demonstrations...Read More »
Things to Consider Before Designing Custom Packaging
This e-Book provides pre-design process considerations for custom corrugated packaging.Read More »
Compal Communications Selects Broadcom® Dual-Core 3G Turnkey Platform for Android Smartphones
Enables Leading Taiwanese ODM to Accelerate Smartphone Production IRVINE, Calif. News Highlights: • Broadcom's complete turnkey solution expedites production and lowers costs of 3G smartphones • New Android smartphones from Compal feature a dual-core HSPA+ processor, VideoCore-® multimedia and an advanced connectivity suite for unsurpassed performance at an affordable price point • Compal...Read More »
Display Processor supports high-resolution video walls.
With up to 16 inputs and 16 outputs,- OmniWall™ is suited for 2 x 2, 3 x 3, or 3 x 4 screen arrays, or linear configurations from 1 x 16 to 16 x 1. For larger video walls, OmniWall 32 offers up to 32 input and 32 outputs. Multiple chassis can be connected in parallel for even larger walls. System supports DVI resolutions up to 1,920 x 1,200, and 4K (UltraHD) up to 4,096 x 2,160. HDCP...Read More »
ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology
HSINCHU, Taiwan and CAMBRIDGE, England - ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARM-® Cortex™-A57 processor on FinFET process technology.- The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end...Read More »
ARM and Synopsys Collaborate to Deliver Optimized Reference Implementations for ARM Processors
Optimized Methodologies for ARM's Cortex-A15, Cortex-A7 and CCI-400 Solutions Help Designers Achieve Processor Performance and Power Objectives Faster CAMBRIDGE, England and MOUNTAIN VIEW, Calif. - - - - -- Processor-specific methodologies accelerate optimized implementation of - - - - - - - ARM-® Cortex-®-A15 MPCore™ and Cortex-A7 MPCore processor clusters as...Read More »
Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging
Aylesbury, Buckinghamshire, UK- Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany. Featured at the show, the Nordson DAGE XD7600NT Ruby FP X-ray and XD7600NT Diamond X-ray with QuickView CT utilize...Read More »
All Programmable SoCs target smart DSP-intensive products.
Combining digital signal processing and ARM processor-based analytics and control, Zynq-7000 Series accelerates development of DSP-intensive products such as wireless radio heads, broadcast encoders/decoders, medical imaging systems, and military communications equipment. Series lets users add increasing levels of software-based intelligence to systems including control, communications, security,...Read More »
Industry Leading OEM with over 65 Years of Experience
Blonder Tongue Laboratories provides ISO 9001:2015 certified electronic contract manufacturing services at our on-site lab. We specialize in video distribution, fiber optics, and communications but have a variety of services available to bring your products to market. See our video to learn more.Read More »