EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices
EVG-® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, Austria- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon...
Read More »QuantumClean® and ChemTrace® to Exhibit at SEMICON Korea 2014
Global Leader in Semiconductor High Purity Process Parts Cleaning, Performance Coatings and Microcontamination Analytical Laboratory Services™ to exhibit at SEMICON Korea 2014 tradeshow. QUAKERTOWN, Pa. - QuantumClean-® and ChemTrace-® today announced that they will be exhibiting at the SEMICON Korea tradeshow, held at the Coex in Seoul, South Korea from February 12(th) through February...
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Dielectric Deposition System is designed for 3D chip packaging.
Applied Producer-® InVia(TM) dielectric deposition system uses CVD process to deposit uniform, thick oxide films in greater than 10:1 high aspect ratio (HAR) through-silicon via (TSV) structures. Process also enables electrical isolation of TSV to ensure reliable performance. For 3D packaging schemes, it electrically connects chips that are vertically stacked to boost speed and lower power...
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Exhaust Management Systems use vacuum and abatement technologies.
Incorporating iXH harsh process vacuum pump and Atlas(TM) gas abatement solutions, Zenith(TM) series helps address vacuum and abatement demands for advanced semiconductor processing at 60 nm and smaller design rules. It offers range of turnkey, process-centric exhaust management solutions for semiconductor manufacturing. Featuring completely integrated components, product range provides full...
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Bulk Briner 101: What You Need to Know When Considering a Bulk Briner
If you're thinking about switching from packaged to bulk salt, check out this white paper and see if a bulk briner is right for your application.
Read More »VESTA Announces Multi-Chamber Order for Its VULCAN System to Leading Foundry in Taiwan
Posted: November 27, 2007 VESTA Technology, Inc., a leading supplier of production proven thermal process systems and an industry innovator in atomic layer deposition (ALD), today announced it received a multi-chamber order for its VULCAN(TM) Single wafer High-k and Metal ALD system from the largest leading foundry based in Taiwan. The foundry, a new ALD customer for VESTA, plans to utilize the...
Read More »Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers
Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven Lithography Solutions SAN JOSE, Calif., Sept. 19 /-- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity...
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Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment
Extending the life of manufacturing equipment, reducing downtime and eliminating contamination Morgan Advanced Ceramics, a leading manufacturer of innovative ceramic, glass, metal and engineered coating solutions, offers Performance Silicon Carbide (SiC) for semiconductor processing equipment manufacturing. Performance SiC is available in two grades, ultrapure and low electrical resistivity....
Read More »New Tools from DEK Enable 25 Micron Backside Wafer Coating at High-Speed
Fueled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultra-thin die attach materials down to 25 microns in thickness. Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per...
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Dispensing System can be configured to suit application.
XyflexPro+ features advanced composite gantry design structure and linear drive system utilizing motion control drive technology. Platform, available as standalone or in-line system, offers flexibility to be configured for various dispense applications within electronics, automotive, and medical industries.
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Custom Fabrication & Machining Services with Over 30 Years of Experience
As a trusted manufacturer to customers across a broad range of industries, Key Gas Components is a premier provider of CNC machining and tube fabrication. Our entire organization is quality driven and customer-centric, with broad-based manufacturing capabilities that can accommodate the most challenging requirements. See our video to learn more.
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