Imprint Lithography Tool meets semiconductor overlay needs.

Leveraging S-FILÂ-® (Step and Flash Imprint Lithography) technology, ImprioÂ-® 300 is used for IC prototyping and process development at 32 nm node and beyond. It offers sub-10 nm resolution patterning in single exposure and can create dense, high-resolution structures in 2 dimensions. Drop-in technology - suitable for mix-and-match strategies where resolution advantage can be deployed on...

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Modular Signal Processor is fully self-contained.

Suited for satellite communications research, training, and analysis, T400MSP produces multi-channel uplink/downlink signals using any combination of BPSK, QPSK, 8PSK, MSK, FSK, AM, FM, and CW modes. It also applies static or dynamic propagation path attributes such as Doppler Shift, Range Attenuation, Range Delay, and Fading. Integrated spectrum analyzer, focused on satellite signal operations,...

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Broadcom Demonstrates Support for All Key Mobile Phone Open Operating Systems on Its Single-Chip Smartphone Solution

Broadcom's 3G Cellular Design Platform Supports Symbian-®, Windows Mobile-® and Linux-®, with Live Demonstrations at 2008 Mobile World Congress BARCELONA, Spain, Feb. 11 -- 2008 MWC -- Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it will demonstrate support for the three most popular open operating systems...

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CEVA Extends Its CDMA Market Reach with VIA Telecom's Latest Design Wins

Dopod, Inventec Applicances and Cal-Comp Electronics join growing list of handset ODMs and OEMs deploying CEVA-powered, VIA Telecom CDMA chipsets BARCELONA, Spain, Feb. 11 -- Mobile World Congress 2008 -- CEVA, Inc.[(NASDAQ:CEVA); ], the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced the CEVA-TeakLite(TM) DSP Core is at the heart of VIA...

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Big Picture Experience from Mobile Devices is One Step Closer to Reality

Texas Instruments DLPÂ-® announces production availability of new imaging chipsets for pico-projection in 2008 BARCELONA, Spain, Feb. 11 -- DLPÂ-® Technology from Texas Instruments (TI) (NYSE:TXN), announced today production availability of a DLP Pico(TM) chipset, which includes an imaging chip and a processor to enable a new class of handheld and mobile projection products. These ground...

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PMC Card provides modular embedded security solution.

Model PMC-110 CryptoNet embedded board includes firewall, intrusion detection, network address translation, IPSec, and hardware-enabled cryptographic engines, enabling designers to add network security functionality to VME, VPX, CompactPCI, and other host embedded boards. Unit features 667 MHz Freescale MPC8555E processor with 256 MB of DDR1 with ECC, 256 MB boot flash, 2 x 10/100/1000 GbE ports,...

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Spreadtrum Ships Thirty Millionth CEVA-Powered Baseband Chipset

CEVA's DSPs power Spreadtrum's SC6600, SC6800 and SC8800 families of wireless chipsets BARCELONA, Spain, Feb. 11 / / -- Mobile World Congress 2008 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications and Spreadtrum Communications, Inc. (NASDAQ:SPRD), one of...

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Continuous Computing and picoChip Partner to Introduce Integrated Femtocell Reference Solution with Complete Protocol Stacks

First-of-its-Kind Partnership Provides Integrated Reference Design for Femtocell Manufacturers to Accelerate Time-to-Money and Reduce Risk MOBILE WORLD CONGRESS (BARCELONA), BATH, ENGLAND, AND SAN DIEGO - February 11, 2008 - Continuous Computing-®, global provider of integrated systems and services that enable telecom equipment manufacturers to rapidly deploy Next Generation Networks (NGN), and...

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Redpine Signals Demonstrates Its Lite-Fi(TM) Ultra Low Power 802.11n Wi-Fi-® Connectivity on Infineon Technologies S-GOLD-® 3H/MP-EH Mobile Platform

Redpine's 802.11n solution achieves less than 1 mW in standby associated mode and more than 200 hours of talk time on a 800 mAH battery for VoWiFi BARCELONA, Spain, Feb. 11 / / -- GSMA Mobile World Congress -- Redpine Signals, Inc., a leading developer of ultra low power multi-standard OFDM and MIMO silicon-based solutions, today announced the availability and successful integration of its...

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STMicroelectronics' Nomadik-® Multimedia Processor Adds Linux and Complete Application Environment from Trolltech

Geneva, February 7, 2008 - STMicroelectronics (NYSE: STM), a leader in delivering high-performance, low-power multimedia solutions for next-generation mobile products, today expanded its Nomadik-® multimedia application processor ecosystem with the integration of Linux and Trolltech's Qtopia application environment in the STn8815 Nomadik engine. This powerful platform provides equipment...

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