Dopod, Inventec Applicances and Cal-Comp Electronics join growing list of handset ODMs and OEMs deploying CEVA-powered, VIA Telecom CDMA chipsets
BARCELONA, Spain, Feb. 11 -- Mobile World Congress 2008 -- CEVA, Inc.[(NASDAQ:CEVA); ], the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced the CEVA-TeakLite(TM) DSP Core is at the heart of VIA Telecom's CDMA baseband processor chosen by Dopod, in collaboration with China Unicom, to power its new range of low-cost handsets for the Chinese market.
Dopod joins the growing list of customers such as Haier, Cal-Comp, Inventec and other Tier-1 handset manufacturers who have chosen VIA's CDMA Baseband Processor ("CBP") solution for ultra low and low-cost handset solutions targeting the "Emerging Markets". VIA Telecom is working closely with key CDMA2000® operators in these regions, including Reliance Communications (India), China Unicom (China) and APBW (Taiwan).
"VIA Telecom is emerging as a compelling cost-effective solution in the CDMA baseband processor arena," said Will Strauss, President & Principal Analyst, Forward Concepts. "The low-cost CDMA handset market is booming in Asia, and with customers including Dopod and Cal-Comp shipping their CEVA- powered CDMA2000 chipsets to these markets, VIA Telecom is well positioned to grow its market share and customer base."
According to the CDMA Development Group (CDG), from Q3 2006 to Q3 2007, APAC witnessed a 32% increase of its CDMA market share bringing the region to 49% of CDMA subscribers worldwide. Fueled by demand for low-cost handsets, India's CDMA2000 subscriber base continues to grow at a record-breaking pace, surpassing 52.5 million fixed and mobile device users in October 2007. Significantly, VIA Telecom supplies its CDMA chipsets to the two largest CDMA operators in India; Reliance Communications and Tata Indicom.
"The CEVA-TeakLite DSP core combined with the excellent engineering support provided by CEVA have been instrumental in the success of our range of advanced CDMA and CDMA2000 baseband processors," said Dr. Ker Zhang, CEO of VIA Telecom. "We look forward to building on our successful relationship with CEVA as we continue to grow our roster of handset OEM customers."
"We are pleased to partner with VIA Telecom as they continue to expand their impressive customer base in the CDMA arena" said Gideon Wertheizer, CEO of CEVA. "VIA's success is a testament to the quality and low-power capabilities of our industry-leading CEVA-TeakLite DSP, and reaffirms CEVA's status as the handset industry's leading licensor of DSP cores worldwide."
The CEVA-TeakLite is a broadly used general-purpose DSP core optimized for low-power and high-performance digital signal processing applications. The core enables a large range of high-volume applications such as cellular handsets, DVDs, disk drives, VoIP gateways, IP phones, mobile audio and more. The core is used as an engine for DSP processing functions such as baseband processing, voice and audio compression, servo control and more. The fully synthesizable, process-independent CEVA-TeakLite can be ported to any ASIC or foundry based designs.
About VIA Telecom
VIA Telecom, Inc., a privately held fabless semiconductor company, is a leading innovator and developer of CDMA chipsets. VIA Telecom's single-chip CDMA baseband processors support IS-95 and cdma2000® technologies and are used in 3G voice, data, and GPS-enabled devices. In addition to its powerful chipsets, VIA Telecom also offers a software development package including customizable user interface, software diagnostic tools, and test support.
VIA Telecom design centers are located in San Diego and Fremont, California; and Hangzhou, China. Sales and marketing offices are located in the United States, Taiwan, China and Korea. http://www.via-telecom.com/
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2007, CEVA's IP was shipped in over 225 million devices. For more information, visit www.ceva-dsp.com/
Source: CEVA, Inc.
Richard Kingston of CEVA, Inc.
Mike Sottak of Wired Island, Ltd.
Web site: www.ceva-dsp.com/