OKI Establishes World's First Mass-production Technology for 0.35 mm pitch 1,000 pin LSI 30-layer Printed Circuit Boards
Breakthrough made possible using OKI's FiTT method based on high-precision lamination and high-precision drilling Enlarged view of 0.35 mm pitch socket connections on a 30-layer 3.5 mm thick socket board TOKYO- – Oki Printed Circuits Co., Ltd. (hereinafter OKI Printed Circuits ), an OKI Group company responsible for printed circuit board business, recently established a mass-production...
Read More »
High-Speed PWB Component Mounter has compact, modular design.
Employing head units on both rear and front sides, RX-6 picks up subminiature, large IC, and odd-shaped components and places them on PWBs. Placement Monitor provides picture of component pick-up/placement to let user monitor mounting process. Rated to 75,000 cph, RX-7 places mainly subminiature components on PWBs. Dual Super Rotary Heads, in parallel head configuration, are equipped with 16...
Read More »PCB/Backplane Handling Equipment manage large and heavy loads.
Using 10 mm wide positive track ESD belts, capped to 3 mm edge contact, conveying solutions can transport up to 40 lb PCB and backplane panels that range up to 30 in.- wide and up to 36 in.- long. Other solutions include vertical buffering, turns, accumulation, and more.
Read More »FlexVIA Plasma System from Nordson MARCH Wins New Product Introduction Award for Surface Treatment of Flexible PCB Materials
Concord, California, USA - Nordson MARCH, a global leader in plasma processing technology, received the New Product Introduction (NPI) Award for its FlexVIA™ Plasma System, a completely self-contained vacuum plasma system designed for maximum efficiency and cost-effective etch, desmear and surface activation treatment of flexible printed circuit boards (PCBs). The award, presented by Printed...
Read More »
Deploying Commercial Electronics in Rugged Environments
This white paper explores how Commercial Off-the-Shelf components can be used efficiently and cost-effectively in critical military applications.
Read More »STMicroelectronics and PNI Sensors are Selected for Nintendo's Wii U
Geneva and Santa Rosa - STMicroelectronics (STM), the world’s leading MEMS manufacturer, and PNI Sensor Corporation, the U.S.- based geomagnetic-sensor manufacturer, today announced that Nintendo Co., Ltd. has adopted an advanced sensor solution for Nintendo's newly launched Wii UTM that includes sensors from ST and PNI. PNI's 3-axis geomagnetic sensor, based on proprietary magneto-inductive...
Read More »
Manncorp to Unveil New Stencil Printer and Vapor Phase System at IPC APEX Expo 2013
Electronic manufacturing equipment provider Manncorp will be unveiling several all-new products at IPC APEX Expo Booth #118 in San Diego, California, February 19-21. Among the new products will be a compact, touchscreen-controlled- vapor phase soldering system- designed for the most complex, temperature-sensitive soldering and conductive adhesive curing applications.- The batch-style system...
Read More »Printed Circuits, Inc. Makes Equipment, Process and Plant Cleanliness Upgrades
Moving from 2012 into 2013 brings a recommitted interest in improving PCi's product and capabilities. Printed Circuits, Inc. (Minneapolis, MN) has made a number of upgrades to improve their products. Items of note are a new die punch, a new conveyorized microetch line, improvements to the lamination layup clean room, and an overhaul of the HVAC system. The new die punch frees up a significant...
Read More »
SMT Chip Mounter features 4-head structure.
CoTRO Head, Sigma F8 achieves ultra high-speed One-by-One Pick-up/Placement using 4 direct drive heads per module. Component range starts at 0402s and delivers placement accuracy of 3σ: -
Read More »Axcelis to Showcase Enabling Implant and Plasma Cleaning Solutions at SEMICON China 2012
Innovative Technology Portfolio Designed to Optimize Precision, Purity and Productivity for 2Xnm and Beyond BEVERLY, Mass. - Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it will showcase its latest advancements in ion implantation and plasma dry strip technology at SEMICON China 2012....
Read More »
Hitachi Sigma Multi-function Placement Head Brings Flexibility, High Accuracy to PCB Assembly; Exhibiting at IPC/APEX 2012
Dallas, Texas, USA- The new Sigma G5 compact, modular mounter, offered by The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA) at APEX, features a unique Multi-function head that greatly enhances the system's flexibility and overall process efficiency. The head is a 3 Spindle (nozzle) head, equipped with vacuum and mechanical gripper nozzles. It can change or...
Read More »
Industry Leading OEM with over 65 Years of Experience
Blonder Tongue Laboratories provides ISO 9001:2015 certified electronic contract manufacturing services at our on-site lab. We specialize in video distribution, fiber optics, and communications but have a variety of services available to bring your products to market. See our video to learn more.
Read More »
