Deposition Systems

Deposition Systems

SPTS Signs Joint Development Program (JDP) for 300mm 3D-IC Application with Fraunhofer IZM ASSID

Fraunhofer ASSID center adds PECVD capability to 300mm device stacking line NEWPORT, United Kingdom - SEMICON Europa - SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has signed a JDP Program with ASSID from Fraunhofer-IZM to research sub-175 degrees C dielectric films in through silicon vias...

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Deposition Systems

Altatech Launches New CVD System to Deposit Advanced Materials Needed in Photovoltaic Manufacturing

MONTBONNOT, France - Altatech, a subsidiary of Soitec, announced today that it has introduced a multi-chamber chemical vapor deposition (CVD) system that enables photovoltaic (PV) cell manufacturers to develop and optimize their solar cell designs using advanced thin-film deposition of amorphous silicon and other materials. By performing all deposition processes within a single system, the new...

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Semiconductor Processing Equipment

IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging

BILLERICA, Mass. - TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now...

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Semiconductor Processing Equipment

Plasma-Therm Receives a Repeat Multi-Module Versaline Order from Wireless Chip Manufacturer

St. Petersburg, FL - Plasma-Therm LLC, a global supplier of plasma process equipment, is pleased to announce the sale of another multi-chamber VERSALINE® production system for etch and deposition to a leading North American wireless compound semiconductor manufacturer. The process modules include an Inductively Coupled Plasma (ICP) etcher for additional capacity for advanced backside GaAs...

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Chemical Machining

Morgan Technical Ceramics Announces High Volume Precision Piezoelectric Material Manufacturing

Morgan Technical Ceramics (MTC) announced that its ElectroCeramics manufacturing site in Bedford, Ohio designs and manufactures a comprehensive range of precision piezoelectric ceramic components made of lead zirconate titanate (PZT) for use in aerospace, medical, industrial, commercial and consumer sensor and actuator applications. The company can produce intricate piezoelectric designs that...

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Deposition Systems

PECVD System supports sub-28 nm dielectric films.

Incorporating interface engineering to minimize RC delay constant without changing materials, VECTOR® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...

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Deposition Systems

Thin Film Vacuum Deposition Cluster Tool Delivered to Naval Research Laboratory

Clairton, PA. - Kurt J. Lesker Company recently shipped a multi-technique, production grade cluster tool to the Naval Research Laboratory in Washington, DC. Various stations of the cluster tool operate in high and ultra high vacuum and make use of advanced physical vapor deposition (PVD) processes, including magnetron sputtering, electron beam and thermal evaporation, and ion assisted deposition...

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Coating Equipment

Altatech Semiconductor Receives CVD Equipment Order from Fraunhofer Research Center in Munich

AltaCVD 200 System Selected for its Ability to Perform Several Deposition Processes on a Variety of Substrates MONTBONNOT, France, Feb. 8, 2011 - Altatech Semiconductor S.A. has received an order for its versatile AltaCVD platform from the Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich, Germany. The 200-mm AltaCVDsystem was selected for its ability to perform...

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Deposition Systems

High-Throughput PECVD System serves semiconductor industry.

Intended for memory manufacturers, VECTOR® Extreme(TM) TEOS xT(TM) plasma enhanced chemical vapor deposition (PECVD) system delivers production throughput in excess of 300 wafers per hour using DPC(TM) hardware for deposition rate optimization, RapidClean(TM) for accelerated chamber cleans, and xT(TM) wafer handler for precision wafer placement. With fewer than 10 particle adders per wafer...

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