Circuit Board Assembly Services

Circuit Board Assembly Services

Epec Engineered Technologies Using Latest Material and Construction Methods to Provide Highest-Quality Flex and Rigid-Flex PCB's

New Bedford, Mass. - Epec Engineered Technologies has been supplying customers with engineering expertise and product solutions in electronics and other technology areas for 60 years now. And one thing that sets the Massachusetts-based company apart is that it constantly is upgrading and improving its services to make sure customers get the absolute best possible service and product choices. For...

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Circuit Board Assembly Services

Epec Engineered Technologies Using Latest Material and Construction Methods to Provide Highest-Quality Flex and Rigid-Flex PCB's

New Bedford, Mass. - Epec Engineered Technologies has been supplying customers with engineering expertise and product solutions in electronics and other technology areas for 60 years now. And one thing that sets the Massachusetts-based company apart is that it constantly is upgrading and improving its services to make sure customers get the absolute best possible service and product choices. For...

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Printed Circuit Board suits thermal management applications.
Circuit Board Assembly Services

Printed Circuit Board suits thermal management applications.

Intended for electronic assemblies where thermal management/heat dissipation capabilities are desired, Powerlink PLPCB combines low-power circuits with high-power bus bars using 2 or more copper weights on same external layer. Multiple layers are possible, with high and low current-carrying capacity on same trace. Outer layer copper weights up to 50 oz/ft-² are usable. With high surface area to...

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Printed Circuit Board suits thermal management applications.
Circuit Board Assembly Services

Printed Circuit Board suits thermal management applications.

Intended for electronic assemblies where thermal management/heat dissipation capabilities are desired, Powerlink PLPCB combines low-power circuits with high-power bus bars using 2 or more copper weights on same external layer. Multiple layers are possible, with high and low current-carrying capacity on same trace. Outer layer copper weights up to 50 oz/ftÂ-² are usable. With high surface area...

Read More »
Circuit Board Assembly Services

MA Manufacturer Goes Beneath the Surface of Surface Mount Assemblies

When it comes to knowledge on the inner workings of electronics the men and women at Distron Corporation in Attelboro Falls, MA are among the best, explains company president, Robert Donovan. In a world constantly influenced by the tiny electronics that have come to change our lives, surface mount assemblies are more essential than ever. According to Donovan, Distron Corporation is poised to do...

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Circuit Board Assembly Services

MA Manufacturer Goes Beneath the Surface of Surface Mount Assemblies

When it comes to knowledge on the inner workings of electronics the men and women at Distron Corporation in Attelboro Falls, MA are among the best, explains company president, Robert Donovan. In a world constantly influenced by the tiny electronics that have come to change our lives, surface mount assemblies are more essential than ever. According to Donovan, Distron Corporation is poised to do...

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ECT to Debut New HyperCore Base Material at SEMICON West 2012
Circuit Board Assembly Services

ECT to Debut New HyperCore Base Material at SEMICON West 2012

Pomona, Calif. - Everett Charles Technologies' (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California. HyperCore is a proprietary base material developed for the highly scalable, fine-pitch ZIP-® architecture. The HyperCore...

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ECT to Debut New HyperCore Base Material at SEMICON West 2012
Circuit Board Assembly Services

ECT to Debut New HyperCore Base Material at SEMICON West 2012

Pomona, Calif. - Everett Charles Technologies' (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California. HyperCore is a proprietary base material developed for the highly scalable, fine-pitch ZIPÂ-® architecture. The HyperCore...

Read More »
ACD Adds a PDR IR-E3 Evolution 2000 BGA Rework System to Its Repertoire
Circuit Board Assembly Services

ACD Adds a PDR IR-E3 Evolution 2000 BGA Rework System to Its Repertoire

RICHARDSON, TX - ACD, a leading supplier to the electronics industry, today announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework. The PDR IR-E3 SMT/BGA rework system is designed specifically to cope with the challenges of repairing today's PCB assemblies using PDR's patented focused IR technology. The system provides ACD with 100 percent...

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ACD Adds a PDR IR-E3 Evolution 2000 BGA Rework System to Its Repertoire
Circuit Board Assembly Services

ACD Adds a PDR IR-E3 Evolution 2000 BGA Rework System to Its Repertoire

RICHARDSON, TX - ACD, a leading supplier to the electronics industry, today announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework. The PDR IR-E3 SMT/BGA rework system is designed specifically to cope with the challenges of repairing today's PCB assemblies using PDR's patented focused IR technology. The system provides ACD with 100 percent...

Read More »

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