Bonders

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications
Bonders

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic MicroLED Technology for AR Applications

PLYMOUTH, England, November 12, 2018 /PRNewswire/ -- Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass...

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Bonders

MRSI Systems Introduces MRSI-HVM3P Equipped with Inline Conveyor for Single Fixture or Multiple Cassette Inputs

The new MRSI-HVM3P is an extension to its existing high-speed MRSI-HVM3 die bonder platform. The bonder offers configuration for active optical cable (AOC), gold-box packaging, chip-on-carrier (CoC) and other applications. The processes include eutectic, epoxy stamping, UV epoxy dispensing and in-situ UV curing. The bonders are equipped with inline conveyors to transport large forms of carriers...

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UV / VISIBLE / LED Curable Multi-Substrate (Plastics) General Bonder
Bonders

UV / VISIBLE / LED Curable Multi-Substrate (Plastics) General Bonder

High Clarity, Cures Tack-Free, Medium Viscosity Bonder Incure Uni-Weld 1924 UV / Visible / LED curable adhesive is an acid-free, multi-substrate medium viscosity bonder. High in clarity and cures tack-free, it is an excellent choice for applications requiring good bonding strength of 2,700 to 5,700 PSI on multiple substrates such as metals, glass, plastics, FR4 materials on a single application....

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Universal's Flexbond Wins Global Technology Award at SMTA International
Bonders

Universal's Flexbond Wins Global Technology Award at SMTA International

Unique architecture enables the first true volume solution for today’s consumer demands. Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and...

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Bonders

Universal Instruments Celebrates Grand Opening of Asia Advanced Technology Center

Newly refurbished facility to showcase automation solutions and deliver comprehensive services. Universal Instruments recently held a celebration ceremony to mark the grand opening of its Asia Advanced Technology Center in Shanghai with the participation of more than 50 distributors, customers and guests from all over China. The company’s flagship Fuzion® platform and new Flexbond™ hot...

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Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic Components
Friction / Fusion Welders

Sonobond Ultrasonics' Wire-to-Terminal Assembly Solutions Satisfy Requirements of Today's Complex Electronic Components

Ultrasonic Metal Welding Capabilities to be on Display at the May 2016 National Wire Processing Expo WEST CHESTER, Pennsylvania – Sonobond Ultrasonics’ metal welding technology is keeping pace with the growing number of increasingly complex electronic components used in automotive and other circuitry.Â-  The company even offers wire-to-terminal welders that produce single point ground...

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Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA
Bonders

Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA

Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The NetherlandsÂ- – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson...

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Sonobond Ultrasonics Celebrates the Resurgence in U.S. Manufacturing Sector
Arc / Resistance Welders

Sonobond Ultrasonics Celebrates the Resurgence in U.S. Manufacturing Sector

US-Made Ultrasonic Metal Welding Machines Offer Manufacturers Increased Productivity and Efficiency WEST CHESTER, Pennsylvania – Sonobond Ultrasonics has been buttressing what some analysts expect will be a resurgence in U.S. manufacturing.Â-  Our faith in the U.S.A. as a manufacturing base has never wavered," says Sonobond President Janet Devine.  She adds that despite the...

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Bonders

Sonobond's Ultrasonic Bonding Technology Increasingly Essential for Ensuring Reliable Body Armor Assembly

More than 30 Leading Manufacturers Use Sonobond Equipment to Achieve Improved Production Speed, Product Durability, Cost-Effectiveness and Compliance with Tough NIJ Standards WEST CHESTER, Pennsylvania — With armed services personnel, emergency responders, law enforcement officers, and others exposed to more and more perilous circumstances, reliable body armor is absolutely essential for their...

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Wafer Bonding Systems support wafers up to 200 mm in diameter.
Bonders

Wafer Bonding Systems support wafers up to 200 mm in diameter.

Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with...

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Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions
Sponsored

Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions

Triad Magnetics is an established leader in power supply innovation, offering product lines that span a wide range of diverse industries and applications. Adding to their long list of successful product launches, Triad announces the release of the new cutting-edge JSU Series of power supplies. To learn about all of its advantages and advanced features, see our video.

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