Laird Technologies

Communication Systems & Equipment

RF Module provides 150 Kbps throughput in half-duplex mode.

Based on FlexRF(TM) technology and operating in 2.4 GHz spectrum, model LT2510 RF module utilizes FHSS air interface protocol and rejects RF noise, handles multipath scenarios, and allows for co-located systems. It is embedded with server-client protocol and enables peer-to-peer operation of in-range modules, while out of range modules can be reached via meshing topology. Featuring SMT package,...

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Computer Hardware & Peripherals

Wireless LAN Module suits video streaming applications.

Offering streaming data rates in excess of 15 Mbps and full embedded TCP/IP stack, model WLM400 802.11b/g wireless LAN module enables embedded designers to take advantage of high data rates available from Wi-Fi networks. It supports ARM9 application processor, UART control port, as well as SPI, I2C, GPIO, and ADC ports. Optimized for low power consumption, module is based on Marvell 8686 Wi-Fi...

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Laird Technologies Announces Four New Bluetooth® Modules for Embedded Designs
Controls & Controllers

Laird Technologies Announces Four New Bluetooth® Modules for Embedded Designs

New ground-breaking range of modules removes complexity and delivers latest Bluetooth features with easy integration. St. Louis, Missouri, USA - October 28, 2008 - Laird Technologies, Inc., a global leader in the design and supply of customized, performance-critical components and systems for wireless and other advanced electronics, today announced the addition of four new Bluetooth® modules...

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Materials

Ferrite Chip Beads suit portable electronic applications.

Supplied in 0.6 x 0.3 x 0.3 mm package, monolithic LI0201 series is comprised of EIA 0201 Ferrite Chip Beads accommodate dense, compact circuit board construction in handheld electronic devices. Impedance versus frequency characteristics minimize DCR for EMI noise suppression on high-frequency or broadband digital signal lines. Products can be placed close to EMI source or receptor of external...

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Communication Systems & Equipment

Base Station Antenna meets WiMAX industry standard.

Featuring dual slant construction, 3.5 GHz Model J33017S00-65N offers antenna-to-antenna co-located isolation, allowing units to be placed in most appropriate position for application. Optimized beam shaper and well-controlled side lobes minimize interference and provide coverage in high-density areas for fixed and mobile access. In addition, 65-degree base station antenna offers uniform energy...

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Communication Systems & Equipment

Base Station Antennas are suited for WiMAX deployments.

Available in 60°, 90°, and 120° versions, 5.0 GHz Vertically Polarized Base Station Antennas are fully compliant with ETSI specifications and provide 4.9-5.9 GHz full-band coverage. They offer null fill below horizon, ensuring uniform energy distribution to each user within each cell, and provide coverage in high-density areas. Along with beam shaper and well-controlled side...

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Materials

Soft Gap Filler suits thermal interface applications.

T-flex(TM) 700, with 5.0 W/mK thermal conductivity and shore OO hardness value of 50, exhibits high compliancy that accommodates applications with high tolerance stack-up and low mechanical stress on components. Available in standard sheets or die cut parts that can be customized, soft gap filler has 0.040-0.200 in. thickness range in 0.010 in. increments. RoHS compliant product targets...

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Communication Systems & Equipment

External Wireless Antenna offers 7 frequency ranges.

Suitable for terminal, PoS, automatic meter reading, and M2M applications, External Wireless Antenna features knuckle/swivel snap-in or SMA/TNC/RPTNC connector option, allowing for integration into variety of devices. Operating frequencies include 824-894, 880-960, 1575, 1710-1880, 1850-1990, 1920-2170, and 2400-2500 MHz. With 7 bands operating simultaneously, blade-style antenna provides...

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Phase Change Material extends lifetime of electronic devices.

Optimized for Intel's Penryn mobile Quad-Core CPU, T-pcm(TM) 670 and T-pcm 680(TM) soften at regular chip operating temperatures to fill microscopic irregularities found in surfaces of microchip package and heat-sink. Mix of thermally conductive fillers and resins serves to minimize resin migration and pump-out. Both RoHS-compliant phase change thermal interface materials are inherently tacky and...

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