Press Release Summary:
Screen-printable and stencilable, Tpcm(TM) 580SP Series exhibits 4.0 W/mK thermal conductivity. Pad contains solvent that assists in processing, which allows wetting of surface. After drying, the solvent is moistureless to the touch, and therefore eliminates mess associated with thermal grease. Once solvent is removed, material begins to soften and flow at temperatures around 45Â°C, minimizing thermal contact resistance by filling in microscopic irregularities.
Original Press Release:
Laird Technologies Releases New Tpcm(TM) 580SP Series Screen Printable Phase Change Material
New Phase Change Material Expands Company's Thermal Interface Materials Product Line
St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tpcm(TM) 580SP Series phase change material.
The Tpcm(TM) 580SP Series is the latest phase change material (PCM) offered in Laird Technologies' thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4.0 W/mK that provides an alternative to thermal grease.
The PCM pad contains a solvent that assists in processing, which allows for wetting of the surface. After drying, the solvent is moistureless to the touch, and therefore eliminates the mess associated with thermal grease. Once the solvent is removed, Tpcm(TM) 580SP begins to soften and flow at temperatures around 45°C; minimizing thermal contact resistance by filling in the microscopic irregularities of the components it touches. Because Tpcm(TM) 580SP softens but does not fully change states; it minimizes migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.
The Tpcm(TM) 580SP series is available in a 0.5 kg or 1.0 kg can for easy manual screen printing and large volume automatic operations. It is ideal for a variety of applications including high frequency microprocessors, notebook PCs, desktop PCs, computer servers, DC/DC converters, memory modules, cache chips, IGBTs, and automotive and optical electronics.
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, please logon to www.lairdtech.com.
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and antenna solutions, as well as radio frequency (RF) modules and wireless remote controls and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 12,000 employees in more than 48 facilities located in 16 countries.
For additional information, visit www.lairdtech.com or contact us at:
Americas: +1-888-246-9050 option 2 or CLVfirstname.lastname@example.org
Europe: +49-(0)-8031-2460-0 or TIM-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x374 or Thermal-ChinaSales@lairdtech.com
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
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