Ironwood Electronics, Inc

IC Sockets support dense pitch QFP devices.
Electrical Equipment & Systems

IC Sockets support dense pitch QFP devices.

With 10 GHz bandwidth, Model SG-QFE-7000 accommodates 128-pin, 14 mm, 0.4 mm pitch TI Power Pad ICs without performance loss. Unit dissipates up to several watts without extra heatsinking and can handle up to 100 W with custom heatsink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, sockets feature temperature range of -35 to +85°C, pin inductance...

Read More »
Electrical Equipment & Systems

QFN Socket attaches 0.4 mm pitch devices.

Rated for up to 500,000 actuation cycles, SS-QFN104A-01 socket dissipates up to 7 W over temperature range of -40 to +120°C without need for additional heatsink and operates at 11.5 GHz bandwidth with less than 1 dB insertion loss. Utilizing high endurance spring pins, it accommodates chip with 104 pins plus ground pad; current carrying capacity is 1.5 A/pin and actuation force is 20 gm/pin...

Read More »
Electrical Equipment & Systems

BGA Socket accommodates 1.0 mm pitch ICs.

Intended for 23 mm, 22X22 array ICs, 10 GHz Model SS-BGA324J-02-01 dissipates up to 7 W without extra heatsinking and can handle up to 60 W with custom heatsink. Contact resistance is typically 30 mOhm per ball. Constructed with spring pins rated at 500,000 actuations, socket operates from -40 to +150°C. Pin inductance is 1.3 nH and mutual inductance is 0.62 nH typically. Capacitance to...

Read More »

All Topics