Ironwood Electronics, Inc
Burnsville, MN 55337
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Burn-in Test Socket accommodates QFN74 with exposed pad.
Operating from -55 to +155°C, CBT-QFN-7038 has clamshell lid and features stamped spring pin contactor with 15 g actuation force per ball and cycle life of 10,000+ insertions. Self inductance of contactor is 0.98 nH, insertion loss is
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Elastomer Socket accommodates QFN34 package.
Designed for 6 x 4.5 mm QFN package with 0.4 mm pitch, Model SG-MLF-7084 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin. Socket is mounted using supplied hardware on target PCB with no soldering. Operating from -35 to +100°C, socket features pin self inductance of 0.118 nH and...
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Stamped Spring Pin Test Socket accommodates BGA243 packages.
Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 hasÂ- stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is
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BGA Socket accommodates hybrid memory cube.
Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA.Â- Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current...
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BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.
Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target...
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QFN Socket accommodates 6 x 6 mm package size.
Available for 0.5 mm pitch QFN40, Model CG-QFN-7009 operates at bandwidth up to 10 GHz with less than 1 dB of insertion loss. Socket features single latch snap lid with integrated spring loaded compression mechanism. Spring force can be adjusted for varying package thicknesses using set screw on top of lid. Mounted using supplied hardware on target PCB with no soldering, socket features contact...
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Xilinx Device Converter adapts embedded FPGAs to existing PCBs.
Allowing replacement of legacy FPGAs without re-spinning motherboard, DC-BGA-XC6SLX16/QFP-XCV300-01 receives Xilinx Spartan-6 family XC6SLX16-2CSG324C embedded FPGA on top and converts pin mapping with additional supporting circuitry, including voltage regulators, to discontinued Xilinx Virtex XCV300-4PQG240I FPGA. This footprint and pin out conversion multilayer PCB, featuring QFP240 leadless...
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BGA Heat Sink Lid Socket operates at bandwidths up to 75 GHz.
Constructed with elastomer contactor, GT-BGA-6008 sockets 27 x 27 mm, 0.8 mm pitch BGA package and operates up to 75 GHz with
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QFN IC Socket connects all pins with 40 GHz bandwidth.
Operating at bandwidths up to 40 GHz with
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DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.
Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs withÂ- BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw...
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