Samtec Expands Signal Integrity Interconnect Product Line


Samtec's ability to provide "Signal Integrity at any Distance(TM)" is being aggressively expanded with new interconnects and signal integrity services. New solutions for Panel and I/O, Cable Assemblies and Board-to-Board applications have been developed as well as expanded signal integrity design resources including Final Inch® PCB design tools.

Board-to-Board solutions include single-ended and differential pair Q Series®, Q2(TM) Series, and Edge Rate connector strips, elevated board stackers, right angle and card edge systems for perpendicular and co-planar board mating. A variety of high density solutions are available including SEARAY(TM) open pin field arrays, HD Mezz elevated stacking arrays, and DP Array® dedicated differential arrays.

Cable solutions feature Samtec's Data Rate high speed coax and twinax cable or high speed flex terminated with a variety of high speed and standard connectors. Data Rate I/O interfaces are available with conventional shielded twisted pair cable construction or Samtec Low Skew Pair cable for higher speed applications.

For more information on Samtec's expanded Signal Integrity product line, contact: Samtec, Inc. o P.O. Box 1147 o New Albany, IN 47151-1147 o Phone: 1-800-SAMTEC-9. or 812-944-6733 o Fax: 812-948-5047 o Internet: www.samtec.com o E-mail: info@samtec.com. HD Mezz is a trademark of Molex Incorporated.

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