STMicroelectronics

Communication Systems & Equipment

MEMS Microphone offers natural voice control in smart devices.

Housed in 3 x 4 x 1 mm package, Model MP34DT01 combines top-port sound-inlet position with SNR of 63 dB and flat frequency response in full audio band of 20-20,000 Hz. In multiple-microphone applications, device enables active noise and echo cancelling as well as beam-forming, which isolates sound and its location. Applications include speech-recognition systems for voice-controlled software and...

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Communication Systems & Equipment

MEMS Microphone offers natural voice control in smart devices.

Housed in 3 x 4 x 1 mm package, Model MP34DT01 combines top-port sound-inlet position with SNR of 63 dB and flat frequency response in full audio band of 20-20,000 Hz. In multiple-microphone applications, device enables active noise and echo cancelling as well as beam-forming, which isolates sound and its location. Applications include speech-recognition systems for voice-controlled software and...

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Electrical Equipment & Systems

Encryption Engine boosts consumer data security.

Designed to protect confidentiality and secure data stored in PCs and laptops, HardCache-SL3/PC includes cryptographic module certified to U.S. NIST FIPS 140-2 Level 3 standard for non-military applications. Hard-wired encryption engine embedded within chip performs all encryption/decryption algorithms that are needed each time system retrieves data stored from memory to central processor with no...

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Electrical Equipment & Systems

Encryption Engine boosts consumer data security.

Designed to protect confidentiality and secure data stored in PCs and laptops, HardCache-SL3/PC includes cryptographic module certified to U.S. NIST FIPS 140-2 Level 3 standard for non-military applications. Hard-wired encryption engine embedded within chip performs all encryption/decryption algorithms that are needed each time system retrieves data stored from memory to central processor with no...

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Communication Systems & Equipment

STMicroelectronics Reveals Advanced Automotive IC Moving Car Makers Closer to Toughest New-Car Environmental Targets

Highly featured CAN chip supporting new partial networking" for improved fuel efficiency and emissions Geneva - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and a leader in both automotive ICs and energy savings has perfected one of the world's first automotive ICs supporting advanced networking technology to...

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Communication Systems & Equipment

STMicroelectronics Reveals Advanced Automotive IC Moving Car Makers Closer to Toughest New-Car Environmental Targets

Highly featured CAN chip supporting new partial networking" for improved fuel efficiency and emissions Geneva - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and a leader in both automotive ICs and energy savings has perfected one of the world's first automotive ICs supporting advanced networking technology to...

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Electrical Equipment & Systems

STMicroelectronics First to Use Through-Silicon Vias for Smaller and Smarter MEMS Chips

GENEVA - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications,(1) is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production. TSV replaces traditional...

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Electrical Equipment & Systems

STMicroelectronics First to Use Through-Silicon Vias for Smaller and Smarter MEMS Chips

GENEVA - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications,(1) is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production. TSV replaces traditional...

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Computer Hardware & Peripherals

STMicroelectronics and Mobileye to Develop Third-Generation System-on-Chip Family for Vision-Based Driver Assistance Systems

GENEVA and JERUSALEM - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leader in the design and manufacture of automotive ICs, and Mobileye N.V., the leading provider of Advanced Driver Assistance Systems (ADAS) to the automotive industry, today announced that the two companies are co-developing the next...

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Computer Hardware & Peripherals

STMicroelectronics and Mobileye to Develop Third-Generation System-on-Chip Family for Vision-Based Driver Assistance Systems

GENEVA and JERUSALEM - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leader in the design and manufacture of automotive ICs, and Mobileye N.V., the leading provider of Advanced Driver Assistance Systems (ADAS) to the automotive industry, today announced that the two companies are co-developing the next...

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