Sokymat SA
Granges CHE
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CPU Module is based on Intel 915GM Express chipset.
Based on COM Express (Type 2) standard, ET810 supports up to 2.0 GHz Intel Pentium M or Celeron M processors with 400 or 533 MHz FSB and accommodates up to 1 GB DDR2 DRAM. Graphics capabilities are based on Intel Graphics Media Accelerator 900 and support CRT display as well as dual-channel LVDS interface. Measuring 90 x 125 mm, module comes with ICH6M integrated 10/100 BaseT Ethernet and...
Read More »Band Saws incorporate dual-column construction.
Designed for structural rigidity, semi-automatic DC300 ToolMaster comes with laser-line pointer and is designed for tool shop operations. Model DC300A is engineered for high-volume, automated metal cutting tasks up to 300 x 300 mm. Both feature precise, parallel movement of frame along columns, which provides fine movement of frame, eliminates influence of center of gravity and cutting forces on...
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Channel Ramps facilitate Segway(TM) scooter loading/unloading.
Weighing 9 lb each, Segway(TM) Traks-® are designed so that 83 lb Segway(TM) human transporter/scooter can be moved into and out of vehicles on its own power. This avoids back pain, muscle strain, and general fatigue to person as well as scratches, dents, and damage to vehicle. Available in 60 in. lengths, extruded aluminum ramps have non-skid surface and hold up to 600 lb. They are hinged for...
Read More »Torque Transducers suit aerospace hydraulic pumps/motors.
Rotating torque transducers utilize non-contact, rotary transformers for sending excitation voltage to, and receiving measurement signals from, strain gage instrumented rotating sensor element. Flange and splined shaft design conforms to AND 10262 and 20002. In addition to torque output signal, optional pickup provides output proportional to speed and optional K type thermal couple to monitor...
Read More »Modular Encoder offers 576,000 measuring point resolution.
Measuring .75 x 1.78 x 2.3 in., CP-250-HHC incremental hollow-shaft encoder offers 8 user-selectable resolutions from 5,000-144,000 quadrature cycles per revolution with repeatability of Ã-
Read More »Oscillator delivers differential LVPECL output.
Manufactured in 6-pad, 7 x 5 mm ceramic SMD, CFPP-620 one-time-programmable oscillator offers expedited delivery at any output frequency from 150-700 MHz. It provides differential low-voltage positive emitter-coupled logic (LVPECL) output and delivers frequency stability of Ã-
Read More »UHF-Band RFID Reader/Writer is RoHS-compliant.
Compatible with UHF frequency bands, monostatic reader/writer uses integral transmission and reception antenna element. It can be connected with up to 4 antennas, maintaining same performance level with one antenna as when 4 antennas are connected to unit. Product supports EPCglobal Class C1b protocol and, by upgrading its firmware, will accommodate Class 1 Generation 2 protocol by EPC Global.
Read More »CompactPCI SBC operates in harsh environments.
With 3U CompactPCIÃ-® form factor, convection- or conduction-cooled CR4 is powered by 1.4 MHz low-voltage IntelÃ-® PentiumÃ-® M processor and capable of system controller or peripheral mode operation. It incorporates Intel 855GME chipset, which includes Intel 855GME GMCH and Intel 6300ESB ICH. Connectivity is provided via 2 Gigabit Ethernet ports, two 32-bit 33/66 MHz PCI bus...
Read More »Software optimizes business-critical processes.
WebSphereÃ-® Business Modeler v6.0 products provide business modeling, simulation, and analysis capabilities that help to visualize, comprehend, and document business processes. Collaboration capability enables team to define business models and eliminate inefficiencies. Users can model business processes and then deploy, monitor, and take actions based upon KPIs, alerts, and triggers for...
Read More »GaN Power FET achieves 174 W output at 6 GHz.
Able to support enhanced microwave communications, gallium nitride (GaN) power field effect transistor (FET) features optimized epitaxial layer with High Electron Mobility Transistor (HEMT) structure. It adopts 4-chip combination structure to minimize heat build-up, and chip structure is optimized in terms of gate length and distance of source. Gate electrode structure contributes to minimal gate...
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