Granta Design Ltd.
Cambridge CB1 7EG GBR
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Software locates application inefficiencies.
Enterprise application performance management products Compuware STROBE v3.1 and Compuware iSTROBE v2.0 help locate and eliminate sources of application inefficiencies. Compuware STROBE 3.1 includes support for DB2 V8, WebSphere Application Server, and Java, while Compuware iSTROBE 2.0 provides web server architecture that can run on mainframe and distributed web servers. Latter also facilitates...
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Test System provides EMC compliance testing.
Featuring resident capabilities for EMC compliance testing to 6 IEC/EN standards, EMCPro PLUS addresses requirements for 100 kHz burst rate per IEC61000-4-4, Edition 2 and 80% dip per IEC 61000-4-11, Edition 2. It offers surge testing to 6 kV with combination, telecom, and ring waves. Unit monitors surge voltage and current at output terminals. For greatest accuracy, it monitors at output of...
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Software suits engraving and woodworking industries.
ArtCAM Pro 7 enables creation of CAD models of human face profiles from digital images. Face Wizard guides user through every stage from import of digital image to generation of CAD model. Envelope distortion tool offers ways to manipulate existing relief by stretching or bending envelope within which it is contained. Multiple Cross-Section Two Rail Sweep provides control and freedom when...
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Modeling Software is suited for complex design work.
PowerSHAPE Pro hybrid modeling software includes all surface and solid modeling capabilities within PowerSHAPE combined with PS-Draft drafting software and PS-Render system for generating photo-realistic images. Combining solid and surface modeling enables case-by-case approach to individual projects. Software provides all solids and surfaces commands from one toolbar and includes embossing...
Read More »WiFi SiP Module suits handheld wireless devices.
Suited for handheld wireless communications applications, 802.11g WiFi system-in-package (SiP) module incorporates WaveLAN chipset from Agere Systems, 16-bit interface, and direct solderless board-to-board connector. It provides 54 Mbps throughput, and deep sleep connected mode enables device to idle at power consumption of 1.5 mA. Product can be used in PDAs, media players, smartphones, WiFi...
Read More »Scalable Access System replaces 802.11 access points.
Wavebend Scalable Access System provides wireless connectivity for 802.11 network mobile hosts and static hosts. Scalable Transmission Control Architecture automatically, dynamically, and transparently provides high throughput during heavy network load conditions. Between 2,400 and 2,600 mobile and/or static hosts can be accommodated for one Wavebend System, at 4-6 kbps of shaped bandwidth....
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Extruded Plastic provides edge protection.
Made from weatherproof plastic, Extruded VBoardÃ-® protects against product damage during shipping and storage. It is 100% waterproof with glossy black finish. Standard sizes are available in leg lengths of 1.75 x 1.75 in. and 2.5 x 2.5 in. with calipers of 0.060, 0.090, and 0.120 in. Extruded VBoardÃ-® is suitable for produce, steel, lumber, and outdoor storage markets.
Read More »Coating protects surfaces from staining.
Applied by spraying, brushing, or rolling, Liquitite SF protects concrete paves, bricks, stone, marble, metal, wood, and similar surfaces from staining caused by spills of non-corrosive household liquids and harsh materials. It seeps and sinks into surface, providing inside out protection. Crystal clear, water-based, non-flammable coating has built-in fungicides and UV protectors. Full cure takes...
Read More »LED Lamp indicates PC status.
Intended for Internet terminal users, PC Status LED Lamp features 8 individually-controllable RGB LEDs mounted inside. With software, user can control colors and brightness. Standard pre-programmed effects include blinking, flashing, colors, and color-flow of color spectrum. Consuming 2 V, USB-powered lamp offers life span up to 50,000 hr constant use.
Read More »Dispenser jets pre-applied solder ball reinforcement.
DispenseJetÃ-® DJ-9000 utilizes method for applying solder ball reinforcement material to semiconductor packages that eliminates need for dispensing secondary underfill in PCB assembly. Unit shoots fluid stream of underfill adhesive as small as 100 Ã-µm wide between balls on CSPs and other BGA packages during semiconductor packaging process. Cured reinforcement material relieves stress at...
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